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NEWS TAGGED CHIPMOS
Monday 25 June 2012
Chipbond, ChipMOS 2Q12 sales to grow 10%
Second-quarter sales at Chipbond Technology and ChipMOS Technologies, two major driver IC packaging and testing houses, are set to register 10% sequential growth driven by brisk demand...
Tuesday 29 May 2012
ChipMOS expects sales growth in 2Q12
LCD driver IC packaging and testing firm ChipMOS Technologies expect second-quarter sales to increase 7-12% sequentially with gross margin up about 0.8pp to 7%, thanks to a pick-up...
Monday 7 May 2012
Chipbond, ChipMOS 2Q12 sales expected to grow
LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales register single-digit growth sequentially thanks...
Tuesday 17 April 2012
Rising demand for small-size driver ICs to boost revenues for Chipbond, ChipMOS
LCD driver IC packaging and testing firms Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales rise driven by growing demand for small-size...
Monday 16 April 2012
ChipMOS expanding LCD driver IC packaging/testing capacity
ChipMOS Technologies, A Taiwan-based provider of IC packaging and testing services, is expanding its 12-inch-wafer gold bumping capacity for packaging and testing LCD driver ICs,...
Wednesday 11 April 2012
Chipbond, ChipMOS see sequential growth in March revenues
LCD driver IC packaging and testing service providers Chipbond Technology reported March revenues of NT$1.172 billion (US$39.7 million), an increase of 7.8% on month. The firm reported...
Monday 19 March 2012
ChipMOS expects sales growth in 2012
Packaging and testing firm ChipMOS Technologies has forecast consolidated revenues for 2012 will increase 10%. The company revealed that net revenues on a US GAAP basis for 2011 grew...
Tuesday 10 January 2012
ChipMOS looks to higher capex in 2012
ChipMOS Technology has set aside a capital expenditure budget of US$85 million for 2012, an increase of 10.4% from 2011.
Tuesday 3 January 2012
Chipbond, ChipMOS develop alternative to gold bumping
Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...
Monday 2 January 2012
ChipMOS aims at 10-15% revenue growth in 2012
Packaging and testing firm ChipMOS Technologies expects its revenues to increase 10-15% to top US$690 million in 2012, thanks to a pick-up in orders for panel-use driver ICs and new...
Thursday 29 December 2011
Rohm reportedly places backend orders with Taiwan firms
Rohm has released orders to ChipMOS Technologies and other Taiwan-based mid-scale packaging and testing firms over the last two months to avoid supply-chain disruptions caused by...
Thursday 24 November 2011
AKM to outsource more backend processing, says president
Japan-based Asahi Kasei Microdevices (AKM), a supplier of mixed-signal ICs for consumer, automotive and communications applications, is looking to raise its backend orders to partners...
Thursday 24 November 2011
ChipMOS to expand logic IC business
Packaging and testing firm ChipMOS Technologies has revealed plans to place a greater emphasis on logic chips, expecting sales ratio for the segment to expand to 20-25% within the...
Tuesday 4 October 2011
Chipbond responds to reports of price reductions
Chipbond Technology, a major Taiwan-based LCD driver IC packaging and testing house, has issued a filing with the Taiwan Stock Exchange (TSE) declining to comment on media reports...
Monday 19 September 2011
ChipMOS reiterates 3Q11 outlook
ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs, has said that its sales guidance for the third quarter of 2011 should remain on track.
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