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NEWS TAGGED CHIPMOS
Friday 15 May 2009
ChipMOS expects margins to turn positive by 4Q09
Taiwan's ChipMOS Technologies, which saw its fourth straight quarterly loss in the first quarter of 2009, has said it expects gross margins to return to positive levels by the fourth...
Thursday 26 March 2009
ChipMOS shipping more Spansion products since March
Memory packaging and testing house ChipMOS Technologies has seen a rebound in orders from the LCD, NOR flash and mask ROM sectors since March, and shipments to insolvent flash maker...
Friday 20 March 2009
ChipMOS diversifying customer base to minimize impact from Spansion insolvency
Taiwan's ChipMOS Technologies is looking to diversify its memory customer base, while having lowered its dependence on Spansion significantly, according to company sources. The IC...
Wednesday 18 March 2009
Tessera terminates patent lawsuit against packaging and testing firms
Tessera Technologies has withdrawn a patent infringement lawsuit against Taiwan- and Singapore-based IC packaging and testing service providers, with industry soruces saying that...
Tuesday 3 March 2009
KYEC and PTI claim no affect from Spansion bankruptcy filing
Taiwan's memory packaging and testing houses King Yuan Electronics Company (KYEC) and Powertech Technology Incorporated (PTI) have filed statements via the Taiwan Stock Exchange (TSE)...
Wednesday 25 February 2009
ChipMOS terminates service agreement with Spansion
ChipMOS Technologies (Bermuda) has announced that on February 19, 2009 its wholly-owned packaging and testing service supplier ChipMOS Taiwan terminated a service agreement with Spansion...
Friday 20 February 2009
Driver IC backend utilization rate at 20-30%
Driver IC packaging and testing companies Chipbond Technology, ChipMOS Technologies and King Yuan Electronics Company (KYEC) recently have been able to receive mostly rush or short-term...
Thursday 22 January 2009
ChipMOS gives Spansion 30 days to settle overdue payments
ChipMOS has sent a notice to Spansion giving the NOR flash maker 30 days to pay off a recent order, or else it will take further action, according to ChipMOS.
Tuesday 20 January 2009
ProMOS continues to sell assets
Packaging and testing house Powertech Technology (PTI) has announced via a filing with the Taiwan Stock Exchange (TSE) that it has acquired wafer testing equipment worth approximately...
Wednesday 7 January 2009
DRAM production cutbacks lead to lower utilization at packaging and testing firms in early 2009
Memory IC packaging and testing houses ChipMOS Technologies, Formosa Advanced Technologies Company (FATC), Power ASE Technology and United Test and Assembly Center (UTAC) are said...
Wednesday 10 December 2008
ProMOS to sell 12-inch equipment; phasing out 8-inch production
ProMOS Technologies plans to sell part of the machinery equipment located at its 12-inch fabs. The company also announced plans to gradually phase out of commodity DRAM production...
Monday 8 December 2008
Packaging and testing houses see weaker NOR flash sales in 4Q
Memory packaging and testing houses ChipMOS Technologies and King Yuan Electronics Company (KYEC) have estimated that sales contributions from NOR flash will slide sequentially in...
Friday 28 November 2008
Micron likely to increase orders for ChipMOS, SPIL and FATC
ChipMOS Technologies, Siliconware Precision Industries (SPIL) and Formosa Advanced Technologies Company (FATC) are expected to benefit from Micron Technology after it completes the...
Wednesday 12 November 2008
ChipMOS gross margins fall to zero in 3Q, will be negative in 4Q
ChipMOS Technologies has reported third quarter revenues of NT$4.36 billion (US$135.3 million), a decrease of 9.5% from NT$4.82 billion (US$149.5 million) in the second quarter of...
Wednesday 5 November 2008
Driver IC packaging and testing houses to see utilization drop to 55-66% in 4Q08
Driver IC packaging and testing houses Chipbond Technology, International Semiconductor Technology (IST), and ChipMOS Technologies will see their utilization rates drop to 55-60%...
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