Auden Techno, a Taiwan-based radio frequency antenna and communications module manufacturer, announced its consolidated revenue for August 2025 reached NT$154 million (approx. US$5.08...
Taiwan's Minister of Economic Affairs Kung Ming-hsin, on September 10, 2025, declined to comment on an alleged trade secret theft targeting TSMC's 2nm process technology amid concerns...
ACM Research (Shanghai), Inc., dual-listed in the US and China, is maneuvering through Washington's escalating curbs on China's chip industry. Chairman David Wang emphasized that...
The global semiconductor industry is experiencing steady growth, driven by advances in wafer processing and packaging technologies. In line with this trend, Tongtai Machine &...
China's state-backed DRAM maker CXMT is rapidly advancing in high-bandwidth memory (HBM), a market long controlled by Samsung Electronics and SK Hynix. Citing SemiAnalysis, South...
The Industrial Development Administration (IDA) of Taiwan's Ministry of Economic Affairs (MOEA) is partnering with 16 local companies to present heterogeneous integration packaging...
TSMC's Japanese subsidiary JASM has completed and started operations at its first wafer fab in Kumamoto. According to Japanese sources, a second wafer fab is already under construction...
Taiwan's traditional industries are facing operational pressures from US reciprocal tariffs. However, to encourage companies to invest in the next phase of growth, the Legislative...
TSMC has confirmed it will exit gallium nitride (GaN) foundry operations within two years, shutting down production at its 6-inch Fab 2 in Hsinchu Science Park. The company is also...
Taiwan-based advanced packaging equipment provider C SUN Manufacturing, Ltd. (TWSE: 2467), now in its 60th year, is undergoing a critical transformation as it expands from its roots...
In the wake of the AI and Electric Vehicle (EV) era, efficient power supply and conversion have become a critical battleground. For over a decade, 3S Silicon Tech has been deeply...
Foundries lead in FOPLP advanced packaging development due to their integrated processes, followed by testing firms that leverage existing wafer architectures. Panel fabs face precision...
To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...
Soaring demand for AI computing is ushering the semiconductor sector into a fresh cycle of high-speed growth, pushing advanced packaging requirements to new heights. From infrastructure...
Universal Microwave Technology (UMT), a Taiwan-based low Earth orbit (LEO) satellite and high-frequency communications provider, announced that its consolidated revenue for August...
