Fan-out panel level packaging (FOPLP) is a promising semiconductor technology that has been attracting investments from Taiwan's supply chains, including IC foundries, OSATs, panel...
While the US has not yet imposed sanctions on China's high-bandwidth memory (HBM) chips and manufacturing equipment, industry sources expect such restrictions are inevitable. This...
SK Hynix and Samsung Electronics are focusing on upgrading equipment, transitioning processes, and expanding high-bandwidth memory (HBM) packaging capacity instead of investing in...
South Korean media report that SK Hynix and Samsung Electronics have reduced their reliance on China over the past seven quarters. SK Hynix's China revenue dropped from 30% to 24%,...
The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and exciting opportunities for the printed circuit board (PCB) and...
Geopolitical tensions have spurred another major shift in global supply chains, as highlighted by TSMC founder Morris Chang's proclamation that globalization is dead. With Donald...
On November 8, news broke that China's 7nm chip manufacturing supply was cut off, prompting major foundries like TSMC and Samsung Foundry to remain silent. However, recent reports...
The global semiconductor manufacturing industry demonstrated strong momentum in the third quarter of 2024, with all key industry indicators showing positive sequential increases for...
Finesse Technology, a subsidiary of Highlight Technology Corp, specializes in semiconductor ozone supply systems, remote plasma sources (RPS), RF power systems, and technical maintenance...
TSMC is strategically developing a dedicated supply chain cluster on 30 hectares (300,000 square meters) of land in Southern Taiwan Science Park (STSP) to strengthen its advanced...
Taiwanese semiconductor equipment manufacturers working with TSMC are benefiting significantly from its orders, with eight of them reporting gross margins of 40-60% in the second...
Driven by rising demand for chip-on-wafer-on-substrate (CoWoS) and other advanced packaging equipment, Taiwan-based semiconductor automation and wet process equipment maker Grand...
Japanese semiconductor equipment manufacturers, including Tokyo Electron and Kokusai Electric, have raised profit forecasts driven by surging AI demand. However, China's cooling semiconductor...
Following a five-year hiatus, Hiwin resumed its in-person earnings call, providing an updated outlook for 2025. The company expects increased economic clarity post-US presidential...
The TPCA Show and IMPACT Conference 2024 was held in Taiwan at the Taipei Nangang Exhibition Center Hall 1 from October 23rd to 25th. Two strategic brand presences of MKS, Atotech,...
