CONNECT WITH US
NEWS TAGGED EQUIPMENT
Wednesday 11 March 2026
Taiwan expands semiconductor R&D infrastructure with new pilot line in the pipeline
Taiwan is deepening its investment in domestic semiconductor research infrastructure, part of a broader push to develop homegrown chip technology capabilities beyond its world-leading...
Wednesday 11 March 2026
Gemtek reports full-year revenue rise despite net loss after one-time charges
Gemtek Technology's board approved the financial report for 2025 on March 9, reporting full-year consolidated revenue of NT$16.493 billion (approx. US$520 million) and a gross margin...
Wednesday 11 March 2026
Inmax advances into memory supply chain with DDR wafer-level test system
Inmax recently announced that its self-developed DDR wafer-level test system has been adopted by a major DDR memory manufacturer and has successfully been validated for mass production...
Tuesday 10 March 2026
Boretech eyes revenue growth in 2026 amid rising petrochemical prices
Intensifying military conflicts in the Middle East have driven up international oil prices, pushing petrochemical product costs higher. PET recycling equipment supplier Boretech has...
Tuesday 10 March 2026
Moxa eyes Middle East market growth amid energy and AI infrastructure demand
Industrial communication and networking equipment provider Moxa has identified the Middle East as a key fast-growing market over the next three to five years, highlighting the region...
Tuesday 10 March 2026
BOE capex slowdown raises concerns for Korean display equipment suppliers
Chinese display maker BOE has signaled that its capital spending will decline in the coming years, raising concerns among South Korean display equipment suppliers that have relied...
Monday 9 March 2026
IEI Integration sees profit squeeze but expects recovery in 2026
IEI Integration faced pressure on revenue and profits throughout 2025, with a further decline recorded in February 2026, citing geopolitical tensions, material shortages, tariffs,...
Saturday 7 March 2026
Foxconn and TSMC advanced packaging spur V5 to consider France, US sites
High-end semiconductor inspection equipment leader V5 Technologies has steadily entered the supply chains of foundry and testing giants in recent years. Chairman Quincy Lin said amid...
Friday 6 March 2026
SuperAlloy targets 2026 growth with semiconductor components and recycled aluminum
SuperAlloy Industrial said it plans to return to growth by 2026, pivoting to semiconductor components and expanding its recycled aluminum capacity, following a subdued year for its...
Friday 6 March 2026
Supply-chain firms become front-line partners as tech outpaces testing and standards
Rapid iteration in AI and low-earth orbit satellite communications has pushed suppliers to assume design and validation roles, reshaping Taiwan's position in global manufacturing e...
Friday 6 March 2026
China chip leaders call for national effort to build 'Chinese ASML'

China's semiconductor industry leaders are calling for a nationwide effort to develop a domestic equivalent of ASML within five years,...

Friday 6 March 2026
Former TSMC SVP leads V5 Technologies' AI inspection push in semiconductor packaging
V5 Technologies, a leading maker of advanced semiconductor inspection equipment centered on AI algorithms, is capitalizing on the explosive growth in advanced process and packaging...
Friday 6 March 2026
China's mature process chip investments alarm Taiwan; government urged to audit local firms' China production
Taiwan's Legislative Yuan has yet to review the 2026 central government budget amid political deadlock, but lawmakers have raised concerns over China's massive subsidies and capacity...
Thursday 5 March 2026
Commentary: HBM hybrid bonding race heats up, but memory makers slow to adopt
Competition in the high bandwidth memory (HBM) market is intensifying, prompting equipment makers such as Hanwha Semitech and Semes to accelerate...
Thursday 5 March 2026
Hanmi Semiconductor strengthens ties with India amid Micron facility launch
South Korean thermal compression bonder leader Hanmi Semiconductor has announced the development of the industry's first dual-function BOC COB Bonder, capable of performing both Board-on-Chip...