French optical equipment company EssilorLuxottica has announced a new long-term agreement with Meta Platforms extending beyond 2030, expanding their collaboration in the smart glasses...
ICP DAS, a Taiwanese industrial PC (IPC) maker, is expecting robust growth for the second half of 2024, driven by strong order pull-ins from its semiconductor equipment customers...
Samsung Electronics has secured a contract valued at approximately US$720 million to supply 4G and 5G telecom equipment to Vodafone Idea, India's third-largest telecom operator. This...
Tongfu Microelectronics and Tianshui Huatian, two major ATMP/OSAT providers in China, have announced fresh investments in their advanced packaging businesses.
The US Department of Commerce (DOC) recently proposed a ban on automotive software and hardware technology and equipment from China and Russia entering the US market. Sino Auto Insights...
Formula One, commonly known as Formula 1 or F1, has expanded its partnership with Lenovo Group due to their shared ideas regarding artificial intelligence (AI) applications, according...
The Biden administration is considering imposing restrictions on the import of high-bandwidth memory (HBM) and related equipment into China, fueling growing demand for domestic substitutes...
Advanced Micro-Fabrication Equipment Inc. China (AMEC), a China-based semiconductor equipment supplier, announced the resignation of Senior Vice President Tuqiang Ni and Core Technical...
China is poised to take the lead in the global market for mature semiconductor manufacturing processes as it continues to expand its production capacity. Industry experts warn that...
The escalating tensions between major powers are reshaping global investment and trade patterns, leading to a surge in companies facing divestment, relocation, and investment shifts...
Japan is the industry leader in materials and equipment, while Taiwan maintains an overwhelming advantage in semiconductor manufacturing, according to Takashi Hattori, deputy representative...
China's latest domestically produced DUV exposure machine cannot perform the critical multiple exposures needed for advanced chip production, making it incapable of achieving finer...
Ever since India embarked on its journey into semiconductor manufacturing, Outsourced Semiconductor Assembly and Test (OSAT) and Assembly, Testing, Marking, and Packaging (ATMP) plants...
Benefiting from TSMC's performance in advanced processes and advanced packaging, related suppliers are also seeing their fortunes rise, further strengthening Taiwan's semiconductor...
China recently achieved a milestone with its indigenous lithography system, which is capable of producing chips at nodes smaller than 65nm. However, the development of an immersive...
