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Sunday 28 September 2025
Hanmi Semiconductor expands into advanced chip packaging for AI era

Hanmi Semiconductor, a rising force in semiconductor equipment manufacturing, is rapidly expanding its influence in the AI hardware ecosystem...

Sunday 28 September 2025
Tokyo Electron revises profit outlook amid China sales slowdown and market shifts
Tokyo Electron has revised downward its net profit forecast for the fiscal year ending March 2026, citing a slowdown in Chinese market sales and customer capital expenditure adjustments...
Friday 26 September 2025
China to command 42% of global chipmaking capacity by 2028, SEMI says
The global semiconductor industry is entering an unprecedented growth phase driven by artificial intelligence, with market forecasts projecting the sector to exceed US$1 trillion...
Friday 26 September 2025
Tata Electronics reportedly in talks with ASML, JT Corp for fab and OSAT projects in India
Tata Electronics is in discussions with several global semiconductor equipment makers, including Dutch giant ASML and South Korea's JT Corp, to supply its upcoming fabrication plant...
Thursday 25 September 2025
Philippines’ pro-US pivot draws Taiwanese network suppliers
Amid changing geopolitical dynamics, Southeast Asia is becoming a key expansion area for Taiwanese manufacturers. The Philippines' shift from pro-China to pro-US, coupled with its...
Thursday 25 September 2025
China builds a multi-track lithography push

Shenzhen-based Wonder Sight has launched its first domestically developed high-precision stepper lithography machine, a milestone in...

Wednesday 24 September 2025
Yole Group CEO interview (Part 2): Post-Moore's Law era sparks advanced packaging race
As Moore's Law approaches physical and commercial limits, advanced packaging has surged as a new battleground in the semiconductor industry. TSMC not only leads globally with its...
Tuesday 23 September 2025
Hanwha Semitech reportedly courts Foxconn, ASE in OSAT race
Hanwha Semitech is stepping up its push into Taiwan's semiconductor supply chain, holding closed-door talks with Foxconn and ASE Holdings at SEMICON Taiwan 2025, according to South...
Monday 22 September 2025
Sunengine enters CPO advanced packaging supply chain
The explosive growth in AI computing demand is driving increased needs for GPUs, ASICs, and other components, accelerating the rapid development of global data center infrastructure...
Monday 22 September 2025
Not just Apple anymore: TSMC's 2nm finds 15 buyers hungry for AI performance
TSMC's 2nm (N2) process is nearing mass production, with industry sources indicating it has secured up to 15 customers. About 10 are focused on high-performance computing (HPC), showing...
Friday 19 September 2025
Samsung and SK Hynix set stage for global battle over HBM4 chips

SK Hynix has announced it is the first in the world to establish a mass production system for sixth-generation High Bandwidth Memory...

Thursday 18 September 2025
Sinbon Electronics drives expansion amid strong global semiconductor demand
Sinbon Electronics is actively expanding its production capacity in response to robust global demand in the semiconductor sector. The company recently secured certifications from...
Thursday 18 September 2025
Arm inaugurates Bengaluru design center, boosting India's chip ambitions
Arm has opened a new chip design center in Bengaluru focused on advanced 2nm chips. Union IT minister Ashwini Vaishnaw called it a milestone for India's semiconductor goals, making...
Thursday 18 September 2025
CoPoS emerges as successor to CoWoS: K&S aligns with AI chip demands
Advanced packaging has emerged as the centerpiece of semiconductor innovation, with industry attention now focused on what will replace the dominant chip-on-wafer-on-substrate (CoWoS)...
Thursday 18 September 2025
Hanwha Semitech stakes early lead in hybrid bonding race for SK Hynix's HBM4
Hybrid bonding machines are set to become critical by 2027, when chipmakers move into mass production of 20-layer, sixth-generation high-bandwidth memory (HBM4). Global equipment...