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    Commentary: Behind Micron's bet for a long memory demand cycles
    3h 31min ago
    Interview: Qnity's Taiwan investment to focus on advanced packaging, CPO and cooling
    3h 31min ago
    GPU and ASIC new platforms to drive stronger server shipments in 2H26
    3h 31min ago
    South Korean memory makers weigh stronger profits from general DRAM than HBM
    3h 31min ago
    MCU price hike expectations drive early 1H26 pull-ins
    3h 31min ago
    iPhone 18 Pro price hike: Memory costs or margin play?
    3h 31min ago
    NEWS TAGGED HBM
    Tuesday 6 January 2026
    SK Hynix says HBM3E to dominate memory in 2026 as HBM4 ramps up

    SK hynix announced on Jan. 5 that it expects its fifth-generation high-bandwidth memory, HBM3E, to remain the dominant product in the...

    Monday 5 January 2026
    Samsung reportedly pitches bundled solutions to Google and AMD
    As major corporations expand investments in artificial intelligence (AI), memory suppliers have seen a flood of orders. According to the latest reports from South Korean media, Samsung...
    Monday 5 January 2026
    ITC launches formal investigation into Samsung and Google over Netlist patent dispute
    The US International Trade Commission (ITC) announced it has launched an investigation into alleged semiconductor patent infringement involving Samsung Electronics, Google, and Supermicro,...
    Monday 5 January 2026
    TSMC's CoWoS outsourcing to ASE and Amkor challenges Samsung
    As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...
    Saturday 3 January 2026
    Micron and GlobalFoundries strengthen Singapore's position in advanced AI chip manufacturing
    Singapore is drawing a new wave of semiconductor investment as global chipmakers expand advanced manufacturing tied to artificial intelligence infrastructure, reinforcing the city-state's...
    Friday 2 January 2026
    Samsung gains edge in AI memory race after reportedly leading Broadcom system-level tests
    Samsung Electronics' sixth-generation high-bandwidth memory, HBM4, has reportedly posted the fastest operating speeds in a key technology test run by Broadcom. The results strengthen...
    Friday 2 January 2026
    Samsung aims for 2026 HBM4 mass production after customer validation
    Samsung Electronics plans to begin mass production of its sixth-generation high-bandwidth memory chips in 2026, citing positive feedback from customers as the South Korean tech giant...
    Friday 2 January 2026
    Smartphones and notebook prices could increase as memory lead times extend
    Demand for high-bandwidth memory (HBM) is crowding out production capacity for consumer memory. Despite capacity expansions by major memory makers, including Micron, Samsung, and SK...
    Friday 2 January 2026
    Samsung raises 2025 bonuses for DS division amid memory boom
    Samsung Electronics' Device Solutions (DS) division is set for a strong 2025, driven by robust performance in general-purpose DRAM and high-bandwidth memory (HBM).
    Thursday 1 January 2026
    Commentary: Nvidia's Groq deal reshapes semiconductor industry in 3 key ways
    The biggest recent news in AI chip development is Nvidia's non-exclusive technology licensing agreement with Groq. Nvidia invested US$20 billion to acquire Groq's technology license...
    Wednesday 31 December 2025
    Samsung reportedly plans 50% HBM output surge through 2026

    Samsung Electronics plans to boost its high-bandwidth memory (HBM) production capacity by approximately 50% through late 2026, according...

    Wednesday 31 December 2025
    YMTC goes full speed toward HBF next
    Amid rising US-China tech tensions and tight semiconductor supply chains, YMTC disclosed advances in 3D NAND flash memory and plans to develop high bandwidth flash (HBF) technology...
    Wednesday 31 December 2025
    US ITC opens patent probe into advanced memory
    The US International Trade Commission (ITC) has formally launched a Section 337 investigation into alleged patent infringement involving advanced memory products, naming Samsung Electronics,...
    Monday 29 December 2025
    SK Hynix weighs US expansion for advanced chip packaging
    According to South Korean technology outlet ZDNet Korea, SK hynix is reviewing plans to build its first 2.5D advanced packaging mass production line in the US, a move that...
    Monday 29 December 2025
    Nvidia reportedly sets 4Q26 target for 16-high HBM supply
    Nvidia has reportedly asked memory suppliers to prepare for the delivery of 16-high high-bandwidth memory by the second half of 2026, according to industry sources cited by South Korean...
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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook