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NEWS TAGGED HBM
Tuesday 5 September 2023
Micron to run HBM packaging hub in Taiwan
Micron Technology has disclosed plans for its Taiwan facility to become the hub of advanced packaging for high bandwidth memory (HBM).
Friday 1 September 2023
China reportedly pursuing high bandwidth memory self-sufficiency
China is keen on attaining self-sufficiency in high bandwidth memory (HBM), with ChangXin Memory Technologies (CXMT) to be playing a leading role in the development of HBM, according...
Thursday 31 August 2023
To enhance its HBM competitiveness, SK Hynix expands packaging talents internally
The AI boom has fueled the high-performance semiconductor market. SK Hynix, in light of investment reduction, has elected to expand its HBM technology capabilities through recent...
Thursday 31 August 2023
Samsung breaks through memory bottleneck; announces research results on HBM-PIM and LPDDR-PIM
At the 2023 Hot Chips forum, in addition to Intel's announcement of its data center chip product, the latest report from Korea's TheElec also pointed out Samsung Electronics...
Thursday 31 August 2023
South Korean equipment makers keen on developing new-gen HBM processing tools
The proliferating artificial intelligence (AI) applications are generating significant growth potential in demand for next-generation high bandwidth memory (HBM) chips, driving South...
Wednesday 30 August 2023
SK Hynix accelerates high-NA DRAM development, with trial production set for 2024
After achieving breakthroughs in production technologies for high bandwidth memory (HBM) and 300-layer NAND flash chips, SK Hynix is accelerating the development of the next-generation...
Monday 28 August 2023
Samsung and SK Hynix hitch ride with AI semiconductors as Nvidia's performance soar
Seeing Nvidia's excellent revenue performance in the second quarter of 2023 and the reported plan to expand the production of AI chips like H100, South Korean memory makers like Samsung...
Thursday 24 August 2023
AI server shipments forecast to top 300,000 units in 2024, says DIGITIMES Research
High-end AI server shipments are forecast to reach 337,000 units in 2024, with the generative AI market reaching US$109 billion by 2030, at a compound annual growth rate (CAGR) of...
Tuesday 22 August 2023
Advanced packaging capacity to surge 30–40% in 2024, says TrendForce
With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...
Monday 21 August 2023
HBM memory bit supply to soar in 2024
According to a recent report by TrendForce, memory manufacturers are expanding their production capacities to satisfy the rising demand for processors designed in-house by CSPs. This...
Monday 21 August 2023
SK Hynix releases HBM3E and sends samples to Nvidia
SK Hynix has successfully developed a next-generation high bandwidth memory (HBM) called HBM3E, and has provided samples to Nvidia for performance evaluation, according to a company...
Friday 18 August 2023
Applied Materials expects HBM to experience explosive growth
Applied Materials, the leading semiconductor equipment supplier, announced third-quarter results that significantly exceeded anticipations and expects data centers, EVs, and industrial...
Friday 11 August 2023
Hanmi Semiconductor established new production site to prepare for TSV process orders in HBM
The AI trend has fueled the high-bandwidth memory (HBM) business opportunities, which in turn has brought attention to related equipment supplier Hanmi Semiconductor. Recently, to...
Wednesday 9 August 2023
Samsung establishes new Future Technology Office to compete in differentiated market
Amidst a global economic slowdown, Samsung Electronics is establishing a "Future Technology Office," hoping to be the first to develop new technology, improve product competitiveness,...
Tuesday 8 August 2023
Samsung secures 3nm GAA new orders amid persisting foundry revenue challenges
According to Business Korea, there are rumors suggesting that Samsung foundry, including its System LSI division, may experience losses of up to 1 trillion KRW (approximately...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research