On April 19, SK Hynix announced that it had recently signed a memorandum of understanding (MOU) with TSMC. The two companies will collaborate closely on producing next-generation...
Samsung Electronics' top executives, led by co-CEO Kyung Kye-Hyun, recently visited Taiwan to meet with local suppliers such as Silicon Motion Technology, a major manufacturer of...
Kye Hyun Kyung, head of Samsung Electronics Device Solutions (DS) division, has visited Quanta Cloud Technology (QCT) during his stay in Taiwan, with his itinerary reportedly covering...
The US Department of Commerce (DOC) and Samsung Electronics signed a non-binding preliminary memorandum of terms (PMT) on April 15 to provide up to US$6.4 billion in direct funding...
In recent years, due to the development of the High Bandwidth Memory (HBM) market, the thermal compression (TC) bonder equipment produced by Hanmi Semiconductor has attracted attention...
Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging...
SK Hynix recently announced plans to invest an estimated US$3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
Primary memory manufacturers are expected to encounter increased competition in the High Bandwidth Memory (HBM) industry in the second half of 2024, as manufacturing technology specs...
SK Hynix is expanding the High Bandwidth Memory (HBM) contribution to its DRAM revenues and expects a deepening effect of the customization trend of HBM.
Samsung Electronics announced an increase in its 2024 HBM shipping volume and disclosed more details about the development of its HBM4 product, showing that its specifications are...
Following the plan to construct an advanced semiconductor packaging facility in Indiana, United States, SK Hynix recently detailed its site selection in West Lafayette, as reported...
