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NEWS TAGGED LAMINATE
Thursday 17 January 2019
CCL maker Elite Material sees robust demand for HDI boards in 2019
Taiwan's copper-clad laminate maker Elite Material (EMC) is expected to see 2019 revenue growth driven by robust demand from handset and automotive electronics sectors for its high-density...
Wednesday 9 January 2019
CCL maker Iteq expects orders for 5G infrastructure to pull in later in 1H19
Copper-clad laminate (CCL) specialist Iteq expects orders for 5G infrastructure to pull in from China following the Lunar New Year holiday that ends in early February, with the orders...
Thursday 6 December 2018
CCL firm Ventec approved for listing on TWSE mainboard
The Taiwan Stock Exchange (TWSE) has approved the listing application of copper clad laminate (CCL) supplier Ventec International, which expects to start trading on the TWSE mainboard...
Friday 7 September 2018
Iteq August revenues up, Taiflex down
Copper-clad laminate (CCL) supplier Iteq has announced consolidated revenues of NT$2.09 billion (US$67.8 million) for August 2018, up 9.2% on year and 4.4% sequentially.
Tuesday 21 August 2018
CCL firm Iteq optimistic about gross margin in 2H18
Growing shipments of high-margin products will boost copper-clad laminate (CCL) manufacturer Iteq's gross margin in the second half of 2018, according to the company.
Thursday 16 August 2018
CCL firm Ventec optimistic about 2H18
Copper clad laminate (CCL) supplier Ventec International has expressed optimism about its revenue and profit performance in the second half of 2018, citing seasonal factors.
Friday 3 August 2018
CCL supplier Elite Material posts EPS of NT$1.25 for 1H18
Copper-clad laminate (CCL) maker Elite Material (EMC) has reported net profits declined 53.6% from a year earlier to NT$675 million (US$22.1 million) in the first half of 2018. EPS...
Friday 6 July 2018
Taiflex sees FCCL demand pick up
Taiflex Scientific saw a pick-up in demand for flexible copper clad laminate (FCCL) in June, with its electronic materials business unit posting revenues of NT$780 million (US$25.6...
Friday 15 June 2018
Ventec to apply for listing on TWSE mainboard
Copper clad laminate (CCL) supplier Ventec International plans to apply for listing on the Taiwan Stock Exchange (TWSE) mainboard in the first quarter of 2019, according to company...
Friday 20 April 2018
Global semiconductor packaging materials market reaches US$16.7 billion in 2017
The global semiconductor packaging materials market reached US$16.7 billion in 2017, according to a report by SEMI and TechSearch International. While slower growth of smartphones...
Friday 12 December 2014
China market: FCCL prices under pressure to drop
Prices of copper-clad laminates (FCCL) in China are set to fall in 2015 amid increasing competition, according to industry sources.
Friday 2 August 2013
FCCL makers optimistic about 2H13
Flexible copper-clad laminate (FCCL) demand is expected to see a seasonal pick-up in the third quarter thanks to new product roll-outs and continued growth in China's smartphone market,...
Monday 1 July 2013
Rising high-Tg laminate shipments buoy gross margin for TUC
Taiwan Union Technology (TUC) has enjoyed a ramp-up in shipments of high-margin CCLs for use in servers and 4G LTE base stations since April, which will buoy its gross margin performance...
Friday 26 April 2013
CCL makers 2Q13 sales to rise
Copper-clad laminate (CCL) manufacturers Elite Materials (EMC) and Iteq both expect to post sequential revenue growth in the second quarter buoyed by strong mobile device demand,...
Tuesday 29 January 2013
FCCL firm ThinFlex expects tablet demand to drive company growth in 2013
Flexible copper-clad laminate (FCCL) maker ThinFlex expects brisk demand from the tablet sector to drive its revenue growth in 2013, although revenues for the first quarter of the...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research