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NEWS TAGGED SEMICON TAIWAN 2024
Wednesday 4 September 2024
IEDC leads economic delegation to Taiwan, opens new office
The Indiana Economic Development Corporation (IEDC), the US state's leading economic development agency, has sent Secretary of Commerce David Rosenberg and an economic delegation...
Wednesday 4 September 2024
FOPLP gains momentum in advanced packaging as AI demand surges
As advanced Chip-on-Wafer-on-Substrate (CoWoS) technology captures the spotlight in the semiconductor industry, fan-out panel-level packaging (FOPLP), another advanced packaging technique,...
Wednesday 4 September 2024
Canada's role in AI and semiconductor innovation is not to be underestimated
Canada is poised to play a crucial role in advancing artificial intelligence (AI) technologies in the coming years. As the country holds vital solutions to overcome various industry...
Wednesday 4 September 2024
SEMICON Taiwan 2024: AI chipmaking, HBM in spotlight
Key AI chipmaking and high-bandwidth memory (HBM) technologies will be highlighted at SEMICON Taiwan 2024, where major manufacturers will gather to present their most recent develo...
Wednesday 4 September 2024
SEMICON Taiwan 2024 forums to highlight CoWoS, FOPLP, SiPh
SEMICON Taiwan 2024 is set to take place from September 4 to 6 and will feature over 20 forums.
Wednesday 4 September 2024
SEMICON Taiwan 2024 to feature TSMC, Samsung, SK Hynix
SEMICON Taiwan 2024 will feature more than 1,000 firms and up to 3,700 booths, including Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics, and SK Hynix.
Tuesday 3 September 2024
Polish semiconductor suppliers gear up for SEMICON Taiwan 2024
With SEMICON Taiwan 2024 soon to kickstart on September 4, Polish semiconductor suppliers are preparing to strengthen their ties with Taiwan. Supported by the Polish Investment and...
Tuesday 3 September 2024
iCatch Technology to showcase GDPR-compliant dashcam solutions at SEMICON exhibition
iCatch Technology, a leading AI image processing IC design company, is excited to announce its participation in the SEMICON Taiwan 2024 Exhibition, taking place from September 4-6,...
Tuesday 3 September 2024
At SEMICON Taiwan 2024, the AI focus turns to memory and network chipmakers
After more than a year of insight into AI models and hardware, the market has a better understanding of the upcoming bottlenecks facing cloud-based generative AI: high bandwidth memory...
Monday 2 September 2024
As GenAI transforms semiconductor technology, materials also need to become 'smart'
SEMICON Taiwan 2024 is fast approaching, and this year's event focuses on key industry topics such as advanced processes, heterogeneous integration, compound semiconductors, silicon...
Thursday 29 August 2024
Brewer Science presents materials' impact in sustainable processes, AI, HPC
Presentation at SEMICON Taiwan 2024 demonstrates how materials impact sustainability, artificial intelligence (AI), and high-performance computing (HPC).
Thursday 29 August 2024
Enhanced semiconductor manufacturing capabilities showcased at SEMICON Taiwan 2024
In a significant leap forward for semiconductor manufacturing, ifm, a global leader in sensor technology, exhibited a comprehensive suite of smart sensing solutions at SEMICON Taiwan...
Wednesday 28 August 2024
3S Silicon will unveil its latest development of the 3S Open Lab Platform, helping RD teams turn smart concepts into valuable reality, for EV Power Modules packaging
Under the theme of "3S Open Lab Platform," 3S will present its achievements and advancements at SEMICON Taiwan 2024, showcasing the unique capabilities of the 3S Open Lab Platform.
Wednesday 28 August 2024
Reliya attends SEMICON 2024 along with gas equipment from ASDevices, Simpure, Tiger Optics
In today's fast-growing industry, the accuracy and stability of gas equipment are indispensable to semiconductor manufacturing. As an integrator in the gas field, Reliya Tech. has...
Wednesday 28 August 2024
Henkel Semiconductor capillary underfill enables complex AI and HPC large body advanced packaging designs
Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding...
CPC
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research