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NEWS TAGGED ULTRA-THIN
Tuesday 2 June 2009
Acer leads CULV notebook competitors by 6-9 months, claims chairman
Acer's global notebook market share is expected to grow further since the company is leading its competitors by six to nine months in the CULV notebook market, according to company...
Tuesday 2 June 2009
Computex 2009: Notebook becoming a major business line for MSI
Thanks to the success of its Wind netbook, first-tier motherboard makers Micro-Star International (MSI) has been able to successfully transition from motherboards to notebook production,...
Wednesday 27 May 2009
HP to launch CULV-based notebooks using old chassis designs
Hewlett-Packard (HP) plans to launch CULV-based notebooks using chassis designs from existing notebooks before introducing ultra-thin designs in the fourth quarter, according to sources...
Tuesday 26 May 2009
Wistron makes Lenovo ultra-thin notebook and 12.1-inch netbook, says paper
Wistron is the manufacturer of Lenovo's new 13.3-inch CULV-based ultra-thin notebook and 12.1-inch Nvidia Ion-based netbook, according to a Chinese-language Apply Daily re...
Friday 22 May 2009
Ultra-thin notebook proportion to reach 20%, says Acer manager
Acer expects CULV-based ultra-thin notebooks will account for around 20% of its total notebook shipments in the future as consumer reaction toward the product line are mostly positive,...
Thursday 21 May 2009
Optical drive issue reported in Acer 15.6-inch ultra-thin notebook
The optical drive of Acer's upcoming 15.6-inch CULV-based ultra-thin notebook, which is manufactured by Wistron, reportedly had a defect that could have caused the drive to stop running,...
Tuesday 19 May 2009
Notebook component shortage likely to get worse in 2H09, says Inventec
The supply of key notebook components may continue to worsen in the second half of 2009 leading to increasing costs, according to Alexander Hsu, president of Inventec's finance division...
Friday 15 May 2009
MSI unveils ultra-thin notebooks and Wind Top-series all-in-one PCs
Micro-Star International (MSI) has unveiled CULV-based X-Slim series notebooks and 12-inch Wind U series netbooks as well as Wind Top series all-in-one PCs. However, volume shipments...
Thursday 14 May 2009
Taiwan market: Asustek launches Eee PC 1008HA
Asustek Computer, on May 13, launched the 10.1-inch ultra-thin Eee PC 1008HA in both Taiwan and Hong Kong priced at NT$19,000 (US$578). The company expects the netbook's shipments...
Thursday 14 May 2009
Nan Ya PCB begins shipments of HDI boards for CULV notebooks
Nan Ya Printed Circuit Board (NPC) began shipments of high-density interconnect (HDI) boards for CULV notebooks this month and expects shipment volumes to increase progressively throughout...
Tuesday 12 May 2009
Intel outlines notebook plans for 2H09
Intel recently outlined its plans for traditional notebook, CULV-based ultra-thin notebook and netbook product lines for its partners, according to sources at notebook makers.
Friday 8 May 2009
Compal expects notebook shipments to grow 15-20% sequentially in 2Q09, says company president
Compal Electronics expects its second-quarter notebook shipments to grow 15-20% to 7.2-7.5 million units from 6.3 million units shipped in the first quarter, company president Ray...
Thursday 7 May 2009
Acer starts selling ultra-thin notebook
Acer has started selling its first CULV-based ultra-thin notebook – the 13.3-inch Timeline 3810T. The notebook adopts Intel's Core 2 Solo SU3500 CPU and GS45 chipset, along...
Tuesday 5 May 2009
Six Taiwan-based notebook makers preparing white-box CULV shipments
Six Taiwan-based notebook makers are preparing to launch CULV-based ultra-thin notebooks for the white-box market, according to industry sources in Taiwan.
Monday 4 May 2009
Asustek to launch 11.6-inch Eee PC later this month
Asustek Computer plans to launch an 11.6-inch Eee PC later this month, but will still consider 10-inch the mainstream specification for 2009, accounting for 50% of total shipments,...
CHT
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research