STATS ChipPAC has announced the expansion of its wafer-level package (WLP) offering with new 300mm manufacturing capabilities in Taiwan. The 300mm WLP operation is located in Hsinchu...

IC packaging and testing house Advanced Semiconductor Engineering (ASE) plans to budget US$700 million in capex for 2011, flat on year, an unnamed company executive has been cited...

STATS ChipPAC on September 15 celebrated the opening of a new manufacturing facility to process 300mm wafers using embedded wafer-level BGA (eWLB) technology. The Singapore-based chip...

Siliconware Precision Industries (SPIL) has entered the LED packaging business and started LED shipments through wirebonding packaging technology to three US-based clients. It is currently...

Aptos Technology, a 20%-held packaging and testing affiliate of Phison Electronics, has announced it recently acquired an 87% stake in wafer-level packaging (WLP) house Advanced Chip...

Advanced Chip Engineering (ACE), a wafer-level packaging and testing house which has investment from King Yuan Electronics Company (KYEC), suffered a fire on the second floor of a...

STATS ChipPAC has announced it is expanding capacity for full turnkey wafer-level packaging in its Singapore operation. The IC packaging and testing service provider said it is on...

Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...