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Tuesday 25 June 2019
Nokia Bell Labs and AMBER formulate new battery design
Researchers at Nokia Bell Labs and AMBER, the SFI Center for Advanced Materials and BioEngineering Research hosted at Trinity College Dublin, have announced they have created a new...
Monday 24 June 2019
Yageo chairman takes helm of Tong Hsing
Tong Hsing Electronic Industries, which provides ceramic substrates and niche-IC backend services, has elected its new board of directors with Yageo chairman Pierre Chen becoming...
Friday 21 June 2019
Collective management at post-Gou Foxconn
Terry Gou has stepped down as chairman of Foxconn Technology Group to facilitate his bid for Taiwan's presidency, handing over the reins to a collective management by a nine-member...
Thursday 20 June 2019
Taiwan to release 2,790 MHz in bandwidth for 5G
Taiwan's government plans to release a total of 2,790 MHz in bandwidth through auction for 5G services, the National Communications Commission (NCC) has announced.
Wednesday 19 June 2019
FPCB maker Flexium tapping 5G, IoT application opportunities
Flexible PCB specialist Flexium Interconnect is looking to explore more application opportunities for its products beyond handsets, especially those for use in 5G and IoT devices,...
Wednesday 19 June 2019
Hybrid cloud in 5G era: Q&A with VMware Taiwan general manager Barry Chen
VMware has teamed up with Taiwan-based partners including Chunghwa Telecom, Chief Telecom, Far EasTone Telecommunications, Systex and Taiwan Mobile to offer its hybrid cloud solution...
Tuesday 18 June 2019
Chang Wah growing pre-mold QFN leadframe offering
Chang Wah Technology (CWTC) continues to enhance its pre-mold quad flat no-lead (QFN) leadframe offerings, and has developed pre-mold metal substrate (PMMS) technology for the emerging...
Tuesday 18 June 2019
IC materials analyzers see robust demand from 5G, AIoT, Wi-Fi 6 applications
Taiwan's dedicated semiconductor materials and devices analysis, testing and verification labs, including Integrated Service Technology, (iST), Materials Aanalysis Technology (MA-tek)...
Monday 17 June 2019
Chipbond to suspend 5G PA packaging capacity expansion
Chipbond Technology will put on hold its 5G PA (power amplifier) packaging capacity expansion originally set to be enforced in the second half of 2019, due mainly to the uncertainties...
Monday 17 June 2019
VIS lands new clients amid trade war, but conservative about 2H19
Vanguard International Semiconductor (VIS) is optimistic about longer-term business prospects as it has enjoyed an increase of new clients amid the US-China trade war, although prospects...
Monday 17 June 2019
MediaTek reiterates sales guidance for 2Q19
Mobile SoC specialist MediaTek expects its sales for the second quarter of 2019 to come within the guidance given previously of 13-21% sequential growth.
Monday 17 June 2019
IC materials distributor Wahlee obtains orders for 5G devices
Wahlee Industrial with its distributed optical communication components and liquid crystal polymer (LCP) materials has entered the supply chain for 5G devices including antenna modules,...
Friday 14 June 2019
Highlights of the day: Optimism for 5G development
The US ban on Huawei does not seem to have dampened the industry players' interests in 5G, with many still expecting explosive growths to come soon. Handset vendors remain as keen...
Friday 14 June 2019
5G commercial runs immune to trade war, says Accton president
The US trade sanctions on Huawei will not slow down global 5G commercial launches, as telecom operators worldwide are still regularly moving to build communications networks though...
Friday 14 June 2019
ASMedia to finish tape-outs for PCIe 4.0 chip solutions by end-2019
Taiwan's ASMedia Technology is expected to complete tape-outs for PCIe 4.0 interface chip solutions by the end of 2019, seeking to strive for more contract design orders from AMD...