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Friday 28 June 2019
Wus Kunshan revenues surge in 1H19
China-based PCB manufacturer Wus Printed Circuit (Kunshan) has estimated a 124-154% rise in revenues for the first half of 2019 compared to a year earlier, with net profit reaching...
Friday 28 June 2019
ZTE set to release 7nm, 5G chip solutions in 2H19
China telecom equipment maker ZTE will deepen its strategic patent deployment in 5G-related technologies and enhance the development of 5G chips, and is slated to release 7nm 5G chips...
Friday 28 June 2019
AR is friendliest interface to information: Q&A with ARPlanet CEO Jennifer Pai
ARPlanet Digital Technology, founded in 2010 as an AR startup, provides a full range of virtual and physical realities integration solutions. The company is now one of few startups...
Thursday 27 June 2019
Huawei unveils 5G deployment plans at MWC Shanghai 2019
At MWC Shanghai 2019, Huawei deputy chairman Ken Hu gave an update on Huawei's progress in 5G deployment, sharing concrete examples of how service innovation and cross-industry collaboration...
Wednesday 26 June 2019
Wafer Works to build 12-inch low-resistivity silicon wafer line
Taiwan-based Wafer Works plans to build up its production capacity for 12-inch low-resistivity silicon wafers, according to industry sources.
Wednesday 26 June 2019
5G to contribute almost US$900 billion to Asia economy over next 15 years
Asia's mobile operators are set to invest US$370 billion building new 5G networks between 2018 and 2025, according to the latest Asia Pacific edition of the GSMA's Mobile Economy...
Wednesday 26 June 2019
ZTE launches 5G/FTTH dual-mode home gateway
ZTE has launched a 5G/FTTH dual-mode home gateway at Mobile World Congress Shanghai 2019. It is compatible with the 5G networks of high bandwidth, low latency and massive connections,...
Wednesday 26 June 2019
Unimicron, Na Ya to gain from high-specs ABF substrates in 2H19
The ever-growing demand for high-performance computing (HPC) chips to support 5G and AI applications is ushering in a long-missed market recovery for ABF substrates needed for high-end...
Tuesday 25 June 2019
Chaun-Choung poised to enter EV heatsink segment
Taiwan-based cooling module maker Chaun-Choung Technology (CCI) is poised to tap into the segment of heatsink solutions for electric vehicles and self-driving cars through Japan's...
Tuesday 25 June 2019
Foxconn readies deployment in 8K+5G ecosystems
Foxconn Technology Group has established complete 8K+5G ecosystems, marking another big step forward in the group's development roadmaps beyond cloud computing, mobile devices, IoT,...
Tuesday 25 June 2019
MOSFET supply chain optimistic about 3Q19
Taiwan power semiconductor MOSFET supply chain players are expected to see notable revenue pickups in the third quarter of 2019 with order visibility stretched through mid-August,...
Tuesday 25 June 2019
Taiwan flexible PCB firms have limited order visibility
Zhen Ding Technology and Flexium Interconnect, both of which are reportedly among the flexible PCB suppliers of Apple, see low order visibility, according to industry sources.
Tuesday 25 June 2019
Nokia Bell Labs and AMBER formulate new battery design
Researchers at Nokia Bell Labs and AMBER, the SFI Center for Advanced Materials and BioEngineering Research hosted at Trinity College Dublin, have announced they have created a new...
Monday 24 June 2019
Yageo chairman takes helm of Tong Hsing
Tong Hsing Electronic Industries, which provides ceramic substrates and niche-IC backend services, has elected its new board of directors with Yageo chairman Pierre Chen becoming...
Friday 21 June 2019
Collective management at post-Gou Foxconn
Terry Gou has stepped down as chairman of Foxconn Technology Group to facilitate his bid for Taiwan's presidency, handing over the reins to a collective management by a nine-member...