"...Goldfinger Mach2MP system is scheduled to ship in 3Q to a major global NAND flash in Japan..."

"...developed a new material for a new generation of non-volatile FeRAM...enables data storage capacity up to five times greater than current materials..."

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"...features a three-dimensional (3-D) chip connection whose approximately 60-micron gap and 50-micron-pitch microbump between the logic and memory devices can support transmissions up to 100 gigabits per second (Gbps)..."

"...small increases in ASP...improved yields and increased shipments on 90nm node... Fab 12A and 12B have a current monthly capacity of over 85K 300mm wafers and Fab 12M will begin mass production in August..."

"...Infineon and Qimonda will pay Tessera one-time license fees of US-Dollar 10 million and US-Dollar 40 million, respectively, during the fourth quarter of the 2006 financial year..."