Home Tech Semiconductors

Winbond cautious for 2005; 0.11-micron on 8-inch wafers faces bottlenecks

Josephine Lien and Hans Wu, Taipei; Jack Lu, DIGITIMES Asia Tuesday 1 February 2005 0

Winbond Electronics is not optimistic about the company’s key market segments in 2005, and the company stated that its DRAM production using 0.11-micron technology on 8-inch wafers is less efficient compared to production on 12-inch wafers.

The article requires paid subscription. Subscribe Now

Email address

Password

Save my User ID and Password

Save my User ID and Password

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

NEW individual users please REGISTER first.

Enterprise user first-time LOGIN.

I forgot my ID and/or password?

MEMBERSHIP BENEFITS