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SPIL looking more aggressive than ASE in wire bonder expansion

Amy Lee, Taipei; Esther Lam, DIGITIMES Asia Thursday 6 October 2005 0

Two leading packaging and testing houses, Siliconware Precision Industries Ltd (SPIL) and Advanced Semiconductor Engineering (ASE), are showing different outlooks with reference to their respective expansion moves. SPIL is aggressively sourcing additional...

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