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ProMOS looks to push DDR2 sales by using low-cost TSOP packaging

Hans Wu, Taipei; Esther Lam, DIGITIMES Asia Wednesday 12 October 2005 0

In order to increase its penetration rate in the DDR2 market, ProMOS Technologies has stared producing TSOP (thin small outline package) DDR2 in addition to traditional BGA (ball grid array) packed DDR2, as TSOP packed DDR2 attains a relatively lower...

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