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Chipbond to buy new testers; 2010 capex to reach NT$2 billion

Ingrid Lee, Hsinchu; Jessie Shen, DIGITIMES Asia Tuesday 29 June 2010 0

Chipbond Technology has announced it plans to spend NT$2 billion (US$62 million) in capex this year, an upward revision from its originally-planned NT$1.5 billion. The LCD driver-IC backend house also revealed plans to add at least 50 testers in the...

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