Copper pillar bump penetration of FC packaging to rise

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Tuesday 29 November 2011 0

Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted unnamed market research firms as saying.

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