As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced packaging technologies to maintain a competitive edge. Manz, which has been investing in developing FOPLP production equipment and solutions for many years, has recently undergone an active transformation, and with proven sales records worldwide, is now one of the top market leaders.
Rising demand for panel-level packaging driving industry transformation
According to Robert Lin, General Manager of Manz Asia, emerging technologies such as 5G and AI are driving a surge in smart applications, leading to rapidly increasing market demand for high-performance semiconductor components. The Fan-Out Panel-Level Packaging (FOPLP) approach, which utilizes square-shaped substrates for better area efficiency compared to round wafer substrates, is particularly advantageous.
This method allows customers, especially display manufacturers, to apply their manufacturing expertise to the production and development of FOPLP technology. For instance, Innolux showcased its research and development achievements in FOPLP at last year's SEMICON Taiwan, garnering significant market attention. Meanwhile, Intel also announced the launch of a next-generation advanced glass substrate packaging solution in 2023. The solution is expected to enter mass production between 2026 and 2030, once again confirming the trend toward large-size panel-level semiconductor packaging.
Breakthrough technologies saving costs and enabling ESG compliance
With the development of market trends and innovations in semiconductor chip packaging production technology, requirements for critical re-distribution layer (RDL) equipment are becoming increasingly stringent. Manz has continued to expand its technological and production capabilities in this area by working with panel manufacturers and other customers.
According to Lin, there are two important research and development technologies that Manz has been focusing on recently. The first is high-quality inkjet direct printing and finishing. Manz has made significant breakthroughs in printing precision, showing great potential for advanced production of surfaces and components.
This high-precision inkjet printing technology increases printing accuracy to 35μm and uses particle-free functional ink as the inkjet material, which is sprayed directly onto the surface of displays, semiconductors, substrates, and other materials. Compared with traditional photolithography, this technology can greatly simplify the RDL process and save expensive equipment and material costs, thereby reducing the overall cost to one-tenth. In terms of production efficiency, process time can be reduced by about 10 times for a 350mm x 350mm substrate, for example.
Manz's high-precision inkjet printing technology not only significantly improves the efficiency and cost-effectiveness of advanced packaging processes, but also reduces the use of chemicals and energy consumption, and avoids the generation of liquid waste. As such, the technology is effective in reducing environmental impact and meeting the ESG requirements of panel and semiconductor manufacturers.
Another of Manz's key technologies is TGV (through glass via). The key to the TGV conduction structure is the electroplating technology, whose properties such as uniformity, current density, and thickness directly affect the yield and reliability of the TGV. Manz has a strong technological base in wet chemical processes, electroplating, and automation equipment, and the company is now using this technological know-how to develop innovative TGV equipment together with upstream and downstream partners.
Continued R&D investment accelerating expansion of market share
Looking to the future, Lin indicated that Manz will continue to expand its R&D investment and proactively engage in talent acquisition to maintain its technological leadership. To offer customers a comprehensive range of manufacturing equipment and services and to prepare for the rapid growth of advanced packaging, Manz is working closely with its supply chain vendors on manufacturing processes, equipment, and material usage.
Moreover, to show its ambition, Manz has established laboratories to assist in material and process testing, thereby providing customers with market-oriented RDL process equipment for advanced panel-level packaging and empowering them to seize the booming business opportunities in semiconductor packaging.
