Apple has introduced its self-developed vapor chamber (VC) cooling technology for the first time in the iPhone 17 Pro series, aiming to maintain high performance during extended use while ensuring a comfortable hand feel. This marks a significant step as Apple aligns with Android smartphone makers who have long implemented advanced cooling solutions in flagship devices.
The company's move addresses the growing heat management demands from increasingly powerful processors. Unlike the ultra-thin iPhone Air, the vapor chamber emerges as a key feature in the latest launch, designed to keep the device cool during intensive tasks. Android manufacturers such as Samsung Electronics, Asus, and Xiaomi have incorporated vapor chambers into their premium models, with Samsung's Galaxy S25 Ultra among the latest examples.
Apple's vapor chamber works by sealing deionized water inside a copper chamber, which evaporates at heated areas and condenses in cooler spots, transferring heat evenly through the iPhone's aluminum alloy unibody chassis. This cooling system stabilizes the temperature of the new A19 Pro chip, improving thermal efficiency and performance.
Vapor chamber cooling enhances performance and supports demanding applications
Apple states that this technology is fully integrated with the A19 Pro chip, enabling the iPhone 17 Pro and 17 Pro Max to deliver around 40% better performance under heavy loads than their predecessors. This advancement makes the devices particularly suitable for gaming, video editing, and AI model computations. The A19 Pro boasts a 6-core CPU, 6-core GPU, and 16-core Neural Engine, capable of hardware-accelerated ray tracing and running high-frame-rate AAA games.
Reports from MacRumors, Apple Insider, and other outlets noted that Apple often hints at new features through visual cues in keynote graphics. The thermal imagery in the fall 2025 event's main visuals was interpreted by industry experts as signaling the new cooling system to support the powerful A19 Pro processor. Further, a well-known leaker revealed in June that Apple's vapor chamber, primarily made of copper, covers a broader area than just the processor and does not noticeably increase the phone's thickness.
Infrared images shared during Apple's event revealed that the vapor chamber extends beyond the processor to cover the camera module. Analysts suggest this design compensates for space constraints in making thinner devices by including chassis and lens structures in the heat dissipation path. This engineering approach also positions Apple for future innovations, such as foldable iPhones, next-generation ultra-thin smartphones, and augmented reality (AR) glasses.
Article edited by Jack Wu
