Jun Otani, executive vice president of Kumamoto University, highlighted the university's 268-year history during a Taiwan-Japan semiconductor supply chain talent forum. Following JASM's establishment of a fabrication plant in Kumamoto, the university has shifted its educational focus to keep pace with rapid changes in high technology
The 2025 SEMI-e Shenzhen International Semiconductor Exhibition and the Integrated Circuit Innovation Expo have concluded. The twin events drew a significant crowd, with 43,986 professional visitors in attendance. A total of 1,062 exhibitors displayed their latest technologies, underscoring the event's importance to the global semiconductor sector
US and Chinese officials entered a second day of negotiations in Madrid on Monday, just as Beijing announced a preliminary ruling that Nvidia had violated antitrust conditions linked to its 2020 acquisition of Mellanox Technologies
Following its major deal with Tesla, Samsung Electronics has won an order from Israeli IC design company Valens Semiconductor to manufacture next-generation automotive system chipsets based on the MIPI A-PHY standard. The chips are expected to be produced using FinFET process technology
Recent market reports indicate that CoWoP has shown preliminary test results exceeding expectations. Nvidia, which leads its development, is expected to accelerate mass production timelines. This development has sparked growing attention on whether the positions of China and Taiwan's printed circuit board (PCB) industries will be reshuffled
Since its IPO application was accepted by Shanghai's STAR Market in September 2024, Wuhan Xinxin Semiconductor Manufacturing Co. (XMC) has updated its prospectus to highlight its move into a pivotal stage of China's 3D integration and silicon-on-insulator (SOI) build-out. Nearly 70% of XMC is directly owned by Cheung Kong (Holdings) Limited, the parent company of Yangtze Memory Technologies Co. (YMTC)
Arm unveiled its Lumex Compute Subsystem (CSS) on September 10 at the Unlocked Summit in Shanghai, signaling its boldest step yet to elevate AI and gaming on flagship smartphones. The platform debuts the C1 CPU cluster based on Armv9.3 and the Mali G1 GPU lineup, headlined by the Mali G1-Ultra with support for second-generation Scalable Matrix Extensions (SME2). Together, they bring edge devices closer to data center-class performance
The Ministry of Economy, Trade and Industry (METI) of Japan announced on September 12, 2025, that it will provide Micron Technology with subsidies amounting to as much as JPY536 billion (US$3.63 billion) for the development and mass production of next-generation DRAM at its Higashihiroshima factory. The assistance is intended to promote advanced research and expand production capacity
IAA Mobility in Munich, Germany, is generally seen as a key indicator for the global automotive industry, compared to CES in Las Vegas, the US, which is a showcase of the strengths of innovative technologies. However, the EU is set to review carbon emission regulations in mid-September 2025, shortly after this year's IAA Mobility. At this sensitive juncture, the direction of the IAA seems to have taken a sharp turn
China's DRAM maker CXMT is reportedly developing compute express link (CXL) DRAM modules, a move that could escalate rivalry with Samsung Electronics and SK Hynix as the CXL market takes off in 2026. According to South Korea's EBN, CXMT has outlined its CXL roadmap to Korean semiconductor component suppliers and begun early design work, with one major substrate partner confirming initial joint R&D on CXL substrates
According to Ddaily, Samsung announced it will expand its India Innovation Campus (SIC) program from four states to ten this year, aiming to train 20,000 students, six times last year's intake. The program, aligned with India's "Make in India" and "Skill India" initiatives, covers AI, IoT, big data, and coding, with potential to feed talent into Samsung's Noida facility, the world's largest smartphone plant
Nvidia has reportedly abandoned its initial SOCAMM1 low-power DRAM module for AI workloads, shifting focus to SOCAMM2 with faster speeds and broader supplier collaboration, including Micron, Samsung, and SK Hynix. This move signals a strategic push to address technical challenges and advance AI memory solutions ahead of mass production in 2026
The technological rivalry between China and the US escalated further on September 12, when the US Department of Commerce's Bureau of Industry and Security (BIS) added 23 Chinese companies, including Fudan Microelectronics Group, to its entity list. Thirteen of these firms are related to semiconductors, with the US alleging the entities undermine national security or foreign policy interests
On September 11, Chinese media reported that Huawei's semiconductor unit HiSilicon has entered a new leadership phase. Eric Xu resigned as chairman, with Jeffrey Gao assuming the role. Huawei senior executives Ken Hu, Guo Ping, and Steven Ren also stepped down from their directorships, leaving He Tingbo — HiSilicon's president and long-time steward — as the sole continuing board-level figure. He Tingbo also holds multiple senior posts at Huawei, serving as Director, Chair of the Huawei Scientist Committee, ITMT Director, and President of the Semiconductor Business Department
Despite ongoing US sanctions that constrain its smartphone sales overseas, Huawei said it has held the No. 1 position in global wearable device shipments for two straight quarters
