Fujifilm plans to strengthen its semiconductor materials capabilities with an investment of JPY 20 billion (US$ 140 million) to build facilities in Shizuoka and Oita, focusing on materials for sub-2nm chip processes, including photoresist

Chung-Hsin Electric and Machinery Manufacturing (CHEM) is witnessing substantial growth driven by aggressive capacity expansion, having acquired multiple factories to boost production by approximately 20% annually. The company is focused on the domestic Taiwanese market and is also pursuing opportunities in Japan, the US, and Southeast Asia to enhance its global presence

Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. The robust spending is being driven by the regionalization of semiconductor fabs and the increasing demand for artificial intelligence (AI) chips used in data centers and edge devices

Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other

The ASEAN market, spanning multiple countries, has become a fiercely competitive battleground for numerous automotive and new energy vehicle (NEV) brands. In this landscape, BYD has continued to stand out, which can be attributed to its successful deep integration with local businesses

Following recent geopolitical tensions, concerns regarding the supply chain security of technology products have intensified globally. The United States has expressed intentions to impose restrictions on connected vehicles from China

SK Hynix is expediting the development of 16-layer HBM3E (High Bandwidth Memory) to reinforce its leading position in the competitive HBM market, as challenges from rivals like Samsung and Micron intensify. The company has successfully confirmed the operational stability of its 16-layer HBM3E, showcasing the robustness of its proprietary MR-MUF (Mass Reflow Mold Underfill) stacking technology

Samsung Electronics has reportedly delayed construction and equipment orders for its Pyeongtaek Phase 4 (P4) plant in South Korea and its second facility (T2) in Taylor, Texas. This move suggests a more cautious approach to semiconductor investments from the South Korean giant, potentially impacting its partner companies

A Chinese venture capital heavyweight Datong Chen has been appointed to the board of directors of China-based IC design company Unisoc. Chen, chairman of Investment Committee, Hua Capital Management, co-founded OmniVision in 1995, and Spreadtrum (now Unisoc) in 2001. Meanwhile, Unisoc has also stepped up its shipments of handset application processors (AP), with its market share now said to be on a par with Apple's

LG Display (LGD) and TCL China Star Optoelectronics Technology (TCL CSOT) have signed an agreement for the latter to buy LGD's 8.5G LCD facility in Guangzhou for CNY10.8 billion (US$1.54 billion), further solidifying the dominance of Chinese companies in the global TV panel market. The sale is expected to be completed by March 31, 2025

Taiwan-based MCU firms generally remain cautious about their sales prospects for the fourth quarter of 2024, primarily due to the slow recovery in demand in China, according to industry sources. But the MCU makers are still expecting sales momentum from emerging applications, such as those for edge AI and new energy cars

The subsidy program implemented by the Chinese government to encourage domestic consumers to replace old TVs with new ones is anticipated to stimulate overall TV demand in the fourth quarter of 2024, according to industry sources

South Korea's semiconductor stockpiles dwindled at the fastest clip since 2009 last month in a sign of sustained demand for high-performance memory chips used in artificial intelligence development

Beijing is stepping up pressure on Chinese companies to buy locally produced artificial intelligence chips instead of Nvidia Corp. products, part of the nation's effort to expand its semiconductor industry and counter US sanctions

The 2024 Tokyo Game Show (TGS), Japan's largest video game exhibition, was held from September 26 to 29, 2024, in Chiba, Japan. The main technological highlight this year was the application of generative AI (GenAI)