A surge in demand for ABF substrates driven by AI applications has created ripple effects across the semiconductor packaging supply chain. Industry sources report that the upstream supply of high-grade fiberglass cloth, a critical material, is being stretched thin. This has caused significant delays in BT substrate deliveries, creating bottlenecks for memory module makers struggling to fulfill urgent orders. Some market watchers anticipate price hikes for BT substrates, with the increase potentially spilling over to ABF substrates as well