Some Taiwan-based LCD driver IC design houses, in order to spread risks, have placed orders for 8-inch bumping packaging and testing services with South Korea- and Japan-based providers,...
Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...
Chipbond Technology has expressed caution about the company's business outlook for the rest of 2011 and first-quarter 2012, as generally weak demand continues to plague the LCD panel...
LCD driver IC packaging and testing house Chipbond Technology has announced plans to repurchase 10 million, or 1.68%, of the company's outstanding shares, at between NT$22 (US$0.73)...
Chipbond Technology, which provides backend services to LCD driver IC suppliers such as Japan's Renesas Electronics, Taiwan-based Novatek Microelectronics and ILi Technology (Ilitek),...
Driver-IC packaging and testing house Chipbond Technology has announced financial figures for the third quarter of 2011 with net profits hiking almost 80% sequentially, as recent...
Vanguard International Semiconductor (VIS), a major LCD driver IC foundry service provider, and driver-IC packaging and testing specialist Chipbond Technology both saw their third-quarter...
Chipbond Technology, a major Taiwan-based LCD driver IC packaging and testing house, has issued a filing with the Taiwan Stock Exchange (TSE) declining to comment on media reports...
LCD driver IC packaging and testing firm Chipbond Technology has reported net income of NT$254 million (US$8.7 million) on revenues of NT$3.445 billion for the second quarter of 2011...
LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies, in view of stagnant demand for LCD panels, expect their revenues for the third quarter of...
LCD driver IC packaging and testing firm Chipbond Technology has expressed uncertainty about the outlook for the third quarter due to low order visibility.
The market of large-size LCD panels have been improving recently. LCD driver IC packaging and testing firm Chipbond Technology has stated the possibility of a better second quarter...
LCD driver IC packaging and testing firm Chipbond Technology has remained cautious about the outlook for the second quarter due to low order visibility. The company expects to report...
Demand for LCD driver ICs used in PC monitors has not picked up as was originally expected, according to industry sources. Meanwhile, that for driver ICs from the LCD TV sector remains...
With more LCD driver IC firms moving from 8-inch wafers to 12-inch, backend service provider Chipbond Technology is set to expand capacity for 12-inch wafers in 2011, according to...
