CONNECT WITH US
NEWS TAGGED CHIPBOND
Thursday 3 March 2011
Chipbond, KYEC team up for power IC packaging and testing
LCD driver-IC packaging and testing firm Chipbond Technology and King Yuan Electronics (KYEC), which specializes in chip probing and final test services, have signed a memorandum...
Tuesday 15 February 2011
Chipbond to report strong EPS for 2011, says paper
Taiwan's Chipbond Technology is expected to enjoy substantial growth sequentially in revenues and profits in the first quarter of 2011, thanks to contributions from subsidiary Chipmore...
Thursday 10 February 2011
VIS January revenues up 12% on order rebound
With LCD driver IC clients having completed inventory adjustments, specialty IC foundry Vanguard International Semiconductor (VIS) saw revenues increase 12.3% sequentially to NT$1.41...
Thursday 20 January 2011
Chipbond responds to media reports on 1Q11 sales
Chipbond Technology has posted a filing with the Taiwan Stock Exchange (TSE) stating it has not issued revenues guidance for the first quarter of 2011.
Thursday 16 December 2010
Chipbond expects sales to start recovering in December
Chipbond Technology, a major Taiwan-based LCD driver IC packaging and testing house, expects December 2010 revenues to grow sequentially after having seen on-month drops over the...
Friday 12 November 2010
Taiwan-based LCD driver IC designers to adopt 12-inch processes soon
LCD driver IC design houses will transition into 12-inch processes at the end of 2010 to the first quarter of 2011. Chipbond Technology is currently the only backend chip packager...
Thursday 11 November 2010
Chipbond expects 10-15% sequential drop in 4Q10 revenues
Panel driver IC packaging/testing house Chipbond Technology expects revenues for the fourth quarter of 2010 to fall 10-15%, according to the company. Chipbond's revenues of NT$1.085...
Thursday 4 November 2010
Chipbond cautious about 4Q10
Chipbond Technology believes its October 2010 sales may have dropped sequentially. The driver-IC packaging and testing firm also estimated total orders for November may be similar...
Wednesday 27 October 2010
Chipbond 3Q10 sales hit record, but miss guidance
LCD driver-IC packaging and testing firm Chipbond Technology has announced revenues for the third quarter of 2010 of NT$3.697 billion (US$121 million), which topped its previous record...
Friday 24 September 2010
Chipbond likely to miss revenue guidance for 3Q10
Chipbond Technology will likely see revenues for the third quarter of 2010 remain flat on quarter, missing its guidance of 5-10% growth, according to market watchers. The driver-IC...
Wednesday 1 September 2010
Demand rebound for large-size panels to move back from August to October, says Chipbond chairman
A demand rebound for large-size LCD panels will take place in the first two weeks of October instead of August as previously expected, Fei-Jain Wu, chairman of driver-IC packaging...
Monday 9 August 2010
Chipbond posts strong 2Q10 results; gives cautious outlook
Packaging and testing house Chipbond Technology has reported better-than-expected revenue and profit results for the second quarter of 2010, reflecting strong market demand for LCD...
Tuesday 3 August 2010
Chipbond expected to post strong profit growth for 2Q10
Chipbond Technology is likely to report that second-quarter net profits more than doubled sequentially to NT$800 million (US$25 million), thanks to higher revenues and gross margin,...
Wednesday 21 July 2010
Chipbond sees moderate growth in 3Q10
LCD driver IC packaging and testing house Chipbond Technology expects July revenues to slightly decrease from June, but overall demand will pick up again in August and September....
Monday 12 July 2010
Chipbond 2Q10 revenues beat guidance
Major Taiwan-based driver IC packaging and testing house Chipbond Technology saw revenues soar 83.5% sequentially in the second quarter of 2010. The significant rise was higher than...
TPCA
Summary of Tech Supply Chain News!
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research
Competitive color technologies expand e-paper market potential, moving beyond zero-sum game, says DIGITIMES Research