Chipbond Technology and International Semiconductor Technology (IST) both expect their fourth-quarter 2009 shipments to likely fall by less than 20% sequentially as a result of seasonality...
Chipbond Technology and International Semiconductor Technology (IST), two major Taiwan-based LCD driver IC packaging and testing houses, have both estimated September 2009 revenues...
Driver IC packaging and testing firm Chipbond Technology saw its monthly revenues hit a record of NT$640 million (US$19.5 million) in August, representing a 52.5% increase from NT$420...
Chipbond Technology is performing better than previously expected in the third quarter of 2009, thanks to growing demand from IDM customers, according to the company. The driver IC...
Driver IC testing and packaging house Chipbond Technology has raised its capex budget for 2009 by 40% to NT$700 million (US$21.28 million), according to the company. The additional...
Chipbond Technology has posted net profits of NT$81 million (US$2.46 million) for July 2009 roughly equal to its net profits of NT$81.65 million for the second quarter.
Chipbond Technology and International Semiconductor Technology (IST) have called for Taiwan to relax restrictions on LCD driver IC packaging and testing production in China. They...
LCD driver IC backend supplier Chipbond Technology saw revenues climb 40.4% to NT$610 million (US$18.6 million) in July 2009, marking an end to its run of on-year drops over the past...
Taiwan-based LCD driver IC backend service providers are expected to see their revenues hit the year's highs in August, thanks to increased demand on seasonality, according to market...
Casio Micronics is looking to sell its gold-bumping equipment, as the Japan-based company already suspended operation of its gold bumping lines in April 2009 amid difficult times,...
Chipbond Technology and International Semiconductor Technology (IST) saw revenues for second-quarter 2009 increase 110.4% and 152.9%, respectively, compared to their revenue results...
Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified outsourcing of LCD driver-IC bumping and...
Renesas Technology is closing production lines and plans to release bump and chip on glass (COG) orders to Chipbond Technology, while NEC Electronics already started releasing chip...
IC packaging and testing companies have indicated that some driver IC customers have suggested raising backend manufacturing prices to speed up production. Chipbond Technology and...
Taiwan-based LCD driver IC backend service providers Chipbond Technology and International Semiconductor Technology (IST) both enjoyed double-digit sequential growths in revenues...
