Renesas Electronics has raised its orders to Powerchip Technology for its LCD driver ICs, and also grown its outsourcing to backend partner Chipbond Technology, according to a recent...
Chipbond Technology has announced it plans to spend NT$2 billion (US$62 million) in capex this year, an upward revision from its originally-planned NT$1.5 billion. The LCD driver-IC...
LCD driver-IC packaging and testing house Chipbond Technology expects revenues for the third quarter of 2010 to grow by 10% on quarter, chairman Fei-Jain Wu said at the company's...
Chipbond Technology has revealed it is currently running at near full capacity for COF (chip-on-film) and COG (chip-on-glass), and utilization for bumping has risen to 85-90%. Customers...
Chipbond Technology has filed an application with the Taiwan government to take up a majority stake in China-based Chipmore Technology, which it now owns almost 20%, according to...
LCD driver IC packaging house Chipbond Technology has announced net profits of NT$398 million (US$13 million) or NT$1.20 per share, for the first quarter of 2010, compared with losses...
Chipbond Technology has reported revenues of NT$801 million (US$25 million) for March 2010, with revenues for the first quarter beating its previous estimates. The LCD driver IC packaging...
LCD driver IC packaging and testing house Chipbond Technology is integrating the different quotes offered by it and International Semiconductor Technology (IST) before their merger,...
LCD driver IC packaging house Chipbond Technology announced on April 1 the completion of its merger with International Semiconductor Technology (IST), with Chipbond being the surviving...
Siliconware Precision Industries (SPIL) has announced that it will take a 15.8% stake in ChipMOS Technologies in exchange for all of its of LCD driver IC packaging and testing equipment...
LCD driver IC backend house Chipbond Technology has stated that its utilization rates for the ongoing first quarter has returned to the high levels recorded in the third quarter of...
Chipbond Technology has announced revenues for January 2010 grew 23.61% sequentially to NT$608 million (US$18.93 million). The LCD driver IC packaging and testing house projected...
Fei-Jain Wu, chairman of driver-IC backend house Chipbond Technology, has predicted that demand for wafer probe testing will exceed supply in March 2010. Wu also believes a similar...
Chipbond Technology has set a capex goal of NT$1.5 billion (US$47 million) for 2010 compared to NT$700 million allocated for the previous year, according to company chairman Fei-Jain...
LCD driver IC packaging house Chipbond Technology has said its merger with International Semiconductor Technology (IST) may be finalized on April 1, 2010 at the earliest. The merger...
