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NEWS TAGGED CHIPBOND
Friday 13 July 2012
Chipbond 3Q12 sales to grow up to 5%
LCD-driver-IC packaging and testing house Chipbond Technology is expected to report sales growth of up to 5% sequentially for the third quarter of 2012, according to market sources...
Tuesday 10 July 2012
ASE, SPIL post sales drops in June
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported decreases in June consolidated revenues from the previous month of 1.7% and 5.9%,...
Wednesday 4 July 2012
Most backend firms give positive 3Q12 outlook
With shipments from upstream chipmakers rising, most Taiwan-based packaging and testing houses are expected to post sequential growth in third-quarter sales.
Friday 29 June 2012
Chipbond gold bumping capacity booked for iPhones, says report
Chipbond Technology reportedly has cut into the supply chain for Apple's iPhone 5 through providing backend services for the LCD driver ICs used in the upcoming iPhones with retina...
Monday 25 June 2012
Chipbond, ChipMOS 2Q12 sales to grow 10%
Second-quarter sales at Chipbond Technology and ChipMOS Technologies, two major driver IC packaging and testing houses, are set to register 10% sequential growth driven by brisk demand...
Monday 18 June 2012
Chipbond sees positive outlook for 2012
Chipbond Technology is optimistic about the business prospects for 2012, according to the LCD driver IC packaging and testing specialist. The firm added it would continue to build...
Monday 11 June 2012
Major Taiwan IC backend firms to post over 5% sales growth in 2Q12
Major Taiwan-based IC packaging and testing houses including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Chipbond...
Tuesday 5 June 2012
Chipbond lands orders for driver ICs used in new iPhone and Samsung TFT-LCD panels
Driver IC packaging testing service provider Chipbond Technology has obtained orders for COG (chip on glass) chips used in screens for a new version of the iPhone, and 8-inch gold...
Monday 4 June 2012
Chipbond lands 8-inch gold bumping orders from Samsung, says paper
LCD driver IC packaging and testing specialist Chipbond Technology reportedly has landed orders for 8-inch gold bumping from Samsung Electronics with shipments to begin in the third...
Monday 7 May 2012
Chipbond, ChipMOS 2Q12 sales expected to grow
LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales register single-digit growth sequentially thanks...
Tuesday 17 April 2012
Rising demand for small-size driver ICs to boost revenues for Chipbond, ChipMOS
LCD driver IC packaging and testing firms Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales rise driven by growing demand for small-size...
Wednesday 11 April 2012
Chipbond, ChipMOS see sequential growth in March revenues
LCD driver IC packaging and testing service providers Chipbond Technology reported March revenues of NT$1.172 billion (US$39.7 million), an increase of 7.8% on month. The firm reported...
Tuesday 3 April 2012
Chipmore to benefit from more panels produced in China
With China adjusting upward its import tariffs for 32-inch and larger LCD panels, the country's self-sufficiency for panels targeted mainly at TVs is expected to rise significantly...
Tuesday 13 March 2012
Chipbond sees flat growth in 1Q12 sales
Chipbond Technology, which provides packaging and testing services for driver ICs used mainly in TV and handset panels, expects its consolidated revenues to register flat sequential...
Friday 10 February 2012
Chipbond sales to rise 5% in 1Q12, says paper
LCD driver IC packaging and testing specialist Chipbond Technology is expected to see its consolidated revenues increase as much as 5% sequentially in the first quarter of 2012, beating...
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