Richard Chang, who founded China's pure-play foundry Semiconductor Manufacturing International (SMIC), has reportedly orchestrated the establishment of a semiconductor photomask materials...

Market observers are generally optimistic about the IC substrate and automotive PCB market prospects in the long term, with both product segments to become major growth drivers for...

Taiwan's tape COF substrate suppliers JMC Electronics and Chipbond Technology are highly conservative about their business prospects for the second half of 2022 due mainly to sluggish...

Niching Industrial, which distributes IC packaging materials, is expected to see its profits hit a record high in 2022 despite falling demand for display driver ICs, according to...

Japan's Sumitomo Metal Mining (SMM) has decided to construct a new 8-inch direct bonded SiC wafer substrate mass-production prototype line, which will be completed for March 2024...

Robust ABF substrate demand boosted profits at Unimicron Technology and Kinsus Interconnect Technology in the second quarter of 2022, which both climbed to record highs.

Robust ABF substrate demand buoyed June revenues at Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology, which all hit record highs.

Foxconn Technology Group has advanced further in building its semiconductor and EV ecosystems by making strategic investment in a Taiwan-based maker of SiC (silicon carbide) substrates...

Unimicron Technology and Kinsus Interconnect Technology, two top ABF substrate manufacturers in Taiwan, were listed 28th and 30th in the Asia IC50 2022 ranking released by DIGITIMES...

Nan Ya PCB is looking to grow its automotive IC substrate sales as a proportion of company revenue to over 10% in 2022, up from 7-8% in 2021, according to company sources.

Samsung Electro-Mechanics (Semco) has announced plans to spend more on its FCBGA packaging substrate production in South Korea and Vietnam.

Unimicron Technology will continue ramping up its ABF substrate capacity till 2025 to cope with increasing demand from the 5G, AIoT, HPC and networking device sectors.

The transition to DDR5 memory in the data center sector will be taking place in 2022, and Micron Technology is gearing up for the robust demand, according to Sumit Sadana, executive...

Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...

System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...