Unimicron Technology is already in talks with its major clients about ABF substrate orders for 2027-2030, as they seek to secure as much new capacity as possible through long-term...

Unimicron Technology has announced plans to merge with Subtron Technology, which specializes in SiP substrates, looking to integrate resources to expand product portfolios and seize...

Kinsus Interconnect Technology is on track to expand its production capacity for ABF substrates by 30-40% in 2022, and by another 40% in 2023, to meet ever-increasing demand for processing...

Taiwan-based Nan Ya Plastics has reported revenues grew 2.1% sequentially and 20.2% on year to NT$35.27 billion (US$1.27 billion) in January 2022, buoyed by rising prices of its electronics...

Nan Ya PCB has reported its consolidated revenue climbed 33.6% on year to a record high of NT$5.24 billion (US$188.3 million) in January 2022.

AU Optronics (AUO) has announced the purchase of a batch of equipment from Mirle Automation for NT$1.02 billion (US$36.6 million).

Taiwan-based Nan Ya PCB, which specializes in the manufacture of IC substrates, has announced plans to further expand fab capacities in Taiwan and China for high-end ABF substrates...

Buoyed by strong graphics card sales, ASRock and TUL are expected to post brisk revenue and profit results in the first half of 2022, according to industry sources.

Taiwan-based ABF substrate suppliers expect the activation of new production capacities later this year and in 2023 to boost their profits amid tight supplies, according to industry...

Green energy gaining momentum amid growing calls for carbon emission reduction is expected to accelerate the penetration of third-generation semiconductors GaN and SiC in EV and industrial...

IC substrate supplier Unimicron Technology is showcasing its newly-developed fan-out panel-level packaging (FOPLP) substrates at the ongoing SEMICON Taiwan 2021, looking to better...

Samsung Electro-Mechanics (Semco) reportedly will set up a new ABF substrate plant in Vietnam mainly to provide dedicated capacity for Intel, with construction slated to kick off...

ABF substrate makers Unimicron Technology, Nan Ya PCB, and Kinsus Interconnect Technology have added capital expenditure to keep expanding production capacities, according to the...

Taiwan-based CCL manufacturer Elite Material (EMC) has disclosed plans to issue NT$3.5 billion (US$125.7 million) in convertible corporate bonds to fund its capacity expansion for...

Taiwan-based Ventec Electronics, dedicated to specialty copper-clad laminates (CCL) and thermal materials, expects shipments of high-performance thermal substrate materials for automotive...