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Tuesday 31 May 2022
China firm to raise capital to fund SiC substrate capacity
Roshow Technology plans to raise additional funds through a private placement to finance its silicon carbide (SiC) wafer and substrate business.
Tuesday 17 May 2022
Capacity expansions at ABF substrate suppliers to buoy Ofuna revenue
Ofuna Technology has enjoyed a strong pull-in of orders from ABF substrate suppliers looking to carry out their capacity expansion projects, according to the Taiwan-based company...
Friday 13 May 2022
ASMedia transitions to 28nm process for part of chip production
ASMedia Technology, an affiliate of Asustek Computer specializing in high-speed transmission chips, has transitioned to 28nm process manufacturing for part of its chip solutions while...
Thursday 5 May 2022
Semco gearing up for server package substrate production
Samsung Electro-Mechanics (Semco) is poised to step into the server package substrate sector with plans to build new production lines for high-end ABF substrates in South Korea and...
Thursday 5 May 2022
AMD to roll out 5nm processors as early as September
AMD is expected to roll out its new-generation processors built using TSMC's 5nm process technology as early as September, according to industry sources.
Tuesday 26 April 2022
ABF substrate makers to see new capacity boost biz results in next 3 years
Taiwan-based ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are expected to commercialize additional capacities boosting their...
Friday 22 April 2022
China SiC substrate supplier to raise funds through IPO
TankeBlue Semiconductor, a Beijing-based silicon carbide (SiC) substrate supplier, plans to raise funds through an IPO to enhance its working capital for technology R&D and production...
Wednesday 20 April 2022
ASE gearing up for HPC chip boom
OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...
Wednesday 13 April 2022
ABF substrate makers thriving on brisk demand for datacenter applications
Robust ABF substrate demand for datacenter applications will boost revenues and profits at Taiwan-based suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect...
Thursday 7 April 2022
IC packaging leadframe, substrate prices to rise in 2Q22
Suppliers of IC packaging materials including leadframes and substrates are poised to raise their prices in the second quarter to reflect rising raw materials costs, despite a slight...
Thursday 7 April 2022
Unimicron, Nan Ya PCB see Kunshan lockdown slightly affect April revenues
An extended COVID lockdown in Kunshan, China is not much constraining PCB and IC substrate supply from plants there operated by Taiwan-based makers Unimicron Technology and Nan Ya...
Thursday 31 March 2022
TSMC to reiterate sales and capex outlook at upcoming investor meeting
TSMC is expected to reiterate its sales growth outlook for 2022 of 25-29% while maintaining its capex target this year of US$40-44 billion at its upcoming investor conference call...
Tuesday 22 March 2022
Semco boosts investment in ABF substrate production
Samsung Electro-Mechanics (Semco) on March 21 announced that it will expand its ABF substrate production capacity at its Busan plant, bringing its total investment in the segment...
Tuesday 22 March 2022
ABF substrate makers continue to see clients queue up for capacity
ABF substrate suppliers continue to see customers queue up for their available capacities, with the visibility of orders extended to at least 2027, according to industry sources.
TPCA
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research