The transition to DDR5 memory in the data center sector will be taking place in 2022, and Micron Technology is gearing up for the robust demand, according to Sumit Sadana, executive...

Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...

System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...

Roshow Technology plans to raise additional funds through a private placement to finance its silicon carbide (SiC) wafer and substrate business.

Ofuna Technology has enjoyed a strong pull-in of orders from ABF substrate suppliers looking to carry out their capacity expansion projects, according to the Taiwan-based company...

ASMedia Technology, an affiliate of Asustek Computer specializing in high-speed transmission chips, has transitioned to 28nm process manufacturing for part of its chip solutions while...

Samsung Electro-Mechanics (Semco) is poised to step into the server package substrate sector with plans to build new production lines for high-end ABF substrates in South Korea and...

AMD is expected to roll out its new-generation processors built using TSMC's 5nm process technology as early as September, according to industry sources.

Taiwan-based ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are expected to commercialize additional capacities boosting their...

TankeBlue Semiconductor, a Beijing-based silicon carbide (SiC) substrate supplier, plans to raise funds through an IPO to enhance its working capital for technology R&D and production...

OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...

Robust ABF substrate demand for datacenter applications will boost revenues and profits at Taiwan-based suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect...

Suppliers of IC packaging materials including leadframes and substrates are poised to raise their prices in the second quarter to reflect rising raw materials costs, despite a slight...

An extended COVID lockdown in Kunshan, China is not much constraining PCB and IC substrate supply from plants there operated by Taiwan-based makers Unimicron Technology and Nan Ya...