Samsung Electro-Mechanics (Semco) is poised to step into the server package substrate sector with plans to build new production lines for high-end ABF substrates in South Korea and...
AMD is expected to roll out its new-generation processors built using TSMC's 5nm process technology as early as September, according to industry sources.
Taiwan-based ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are expected to commercialize additional capacities boosting their...
TankeBlue Semiconductor, a Beijing-based silicon carbide (SiC) substrate supplier, plans to raise funds through an IPO to enhance its working capital for technology R&D and production...
OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...
Robust ABF substrate demand for datacenter applications will boost revenues and profits at Taiwan-based suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect...
Suppliers of IC packaging materials including leadframes and substrates are poised to raise their prices in the second quarter to reflect rising raw materials costs, despite a slight...
An extended COVID lockdown in Kunshan, China is not much constraining PCB and IC substrate supply from plants there operated by Taiwan-based makers Unimicron Technology and Nan Ya...
TSMC is expected to reiterate its sales growth outlook for 2022 of 25-29% while maintaining its capex target this year of US$40-44 billion at its upcoming investor conference call...
Samsung Electro-Mechanics (Semco) on March 21 announced that it will expand its ABF substrate production capacity at its Busan plant, bringing its total investment in the segment...
ABF substrate suppliers continue to see customers queue up for their available capacities, with the visibility of orders extended to at least 2027, according to industry sources.
Taiwan's leading PCB specialist Zhen Ding Technology is gearing up to carry out its ambitious 10-year development roadmaps for IC substrates, aiming to rank among the world's top-5...
Apple has just unveiled its M1 Ultra SoC built using in-house-developed UltraFusion packaging architecture, which will be fabricated by TSMC with a 5nm process node and advanced packaging...
Taiwan-based Symtek Automation Asia, which provides automation equipment to support capacity expansions at PCB and IC substrate makers, expects to post a double-digit revenue surge...
