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Tuesday 22 June 2010
Nanya PCB to expand FC substrate capacity by 30%
Nanya PCB (NPC) has announced plans to boost its monthly output of flip-chip (FC) substrates to 40 million units by the end of 2010, up from the current level of 30 million units...
Monday 7 June 2010
IC substrate vendors NPC and Kinsus post strong revenues for May
IC substrate makers Nanya Printed Circuit Board (NPC) and Kinsus Interconnect Technology both saw their revenues increase in a range of 37-38% on year in May due to strong demand...
Thursday 27 May 2010
G-Tech to establish 6G production line
Taiwan-based optical glass processing service provider G-Tech Optoelectronics (GTOC), a member of the Foxconn (Hon Hai) Group, plans to establish a 6G production line and expects...
Wednesday 26 May 2010
Kinsus revises upward 2Q10 revenue guidance
IC substrate maker Kinsus Interconnect Technology has revised upward its revenue guidance for the second quarter of 2010 to a 20-25% sequential growth from the 10-15% projected earlier,...
Tuesday 25 May 2010
Nanya PCB to expand capacity for FC substrates and HDI boards
Nanya PCB has revealed plans to boost its flip-chip (FC) substrate capacity by 5-7 million units for a total of 35-37 million units a month by the end of June 2010, and also expand...
Monday 24 May 2010
Chip-resistor substrate maker Leatec likely to hike prices in June
Taiwan-based aluminum ceramic substrate supplier Leatec Fine Ceramic plans to raise its quotes for chip-resistor substrates in June, according to the company.
Thursday 13 May 2010
Laser Tek, Leatec April sales buoyed by strong demand for passive components
Passive component material suppliers Laser Tek and Leatec Fine Ceramics both reported strong revenue gains for April 2010 amid strong booming sales of passive components, according...
Thursday 13 May 2010
LED prices likely to go up 5-10%
LED backlight products may see their prices increase by 5-10% as both upstream LED chip and epitaxial wafer prices will rise soon due to strong market demand, according to sources...
Thursday 29 April 2010
Unimicron to ramp up FC substrate capacity by 15-18% in 3Q10
Unimicron Technology plans to ramp up its capacity for flip-chip (FC) substrates by 15-18% in the third quarter to meet increasing demand, company spokesman Shen Tsai-sheng said at...
Tuesday 27 April 2010
Passive component material suppliers Laser Tek and Leatec to see 10% sequential revenue growth in 2Q10
Laser Tek, which mainly produces SMD (surface-mount-device) packaging materials, and chip-resistor substrate supplier Leatec Fine Ceramics are expected to see second-quarter revenues...
Monday 26 April 2010
Tong Hsing ramping up LED ceramic substrate capacity
LED ceramic substrate maker Tong Hsing Electronic Industries (THEIL) is ramping up output at its plant in Taiwan as the company's new plant in the Philippines is waiting for verification...
Friday 23 April 2010
Sapphire substrates for LED in shortage
Sapphire substrates for LED chip production is in shortage and the supply will remain short until the end of 2010, according to market sources.
Thursday 22 April 2010
LG Display devotes a quarter of 6G capacity to notebook panels, say sources
LG Display (LGD) has devoted one-fourth of its 6G capacity to rolling out notebook panels, helping the company widen its gap with competitors in the segment, according to industry...
Friday 16 April 2010
Packaging material supplier Chang Wah to hand out NT$6 cash dividends for 2009
Packaging material and equipment supplier Chang Wah Electromaterials (CWE) has decided to deal out dividends of NT$6 in cash for 2009, based on the pre-tax profits of NT$564 million...
Monday 12 April 2010
Corning Taiwan running at full capacity
Corning Taiwan's production is running at full capacity to meet customer needs and re-establish its inventory level at the same time due to growing demand for LCD, and the company...