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Tuesday 2 November 2010
Corning 3Q10 sales, profits drop sequentially
Corning has announced sales of US$1.6 billion for the third quarter of 2010, a 6% decrease sequentially but an 8% increase on year. Earnings per share were US$0.50. Excluding special...
Thursday 21 October 2010
Nanya PCB to get more FC substrate backend orders from Intel on better yields
Nanya PCB (NPC) is actively improving its production yield rates for CPU-use flip-chip (FC) substrate packaging in order to gain a larger share of orders from Intel, according to...
Wednesday 20 October 2010
DTF Taiwan LED Supply Chain Technology Forum: Development of thermal substrate technology and LED applications
Thermal issue has always been a key part in the development of the LED industry. Polytronics Technology offers aluminum substrates as the best solution for edge-lit LED TVs. Yi-An...
Thursday 7 October 2010
NPC, Kinsus September revenues down on month
IC substrate makers Nanya Printed Circuit Board (NPC) and Kinsus Interconnect Technology both saw revenues decrease sequentially in September 2010, according to data released by the...
Tuesday 5 October 2010
Taiwan IC substrate makers cautious about 4Q10
Nanya PCB (NPC) and Unimicron Technology have expressed caution about their business outlook for the fourth quarter of 2010, due to a continued slowdown in demand from the PC secto...
Monday 4 October 2010
Excise tax for thin touch-panel glass substrates exempted, says report
In order to support industrial development, Taiwan's Ministry of Finance has agreed to exempt the 10% excise tax for glass substrates that are used for touch panels thinner than 1.1mm...
Wednesday 29 September 2010
Ceramic thin-film substrate maker Tong Hsing ramping output
Ceramic substrate maker Tong Hsing Electronic Industries (THEIL) expects sales of its LED thin-film ceramic substrates to continue on a growth track, and plans to add more production...
Tuesday 28 September 2010
Kinsus to commence operation of China plant
Taiwan-based IC substrate maker Kinsus Interconnect Technology revealed that construction of a new plant in Suzhou, China is near completion, and production will kick off in the fourth...
Tuesday 21 September 2010
Sapphire substrate maker Tera Xtal to debut on emerging securities market, says paper
Shares of sapphire substrate maker Tera Xtal Technology, an associate company of Foxconn Electronics, will debut on Taiwan's emerging securities market on September 24, according...
Tuesday 14 September 2010
Persistent shortage of sapphire substrates to drive quotes above US$30 in 4Q10
With persisting shortages for sapphire substrates, quotes are expected to trend up into the fourth quarter of 2010 and will exceed US$30/unit. To prevent idle production lines, some...
Friday 3 September 2010
Ceramic substrate vendor Leatec looks to improved gross margin in 3Q10
Aluminum ceramic substrate supplier Leatec Fine Ceramic is expected to see it gross margin improve to 30-33% in the third quarter from 23.6% in the second thanks to price hikes of...
Monday 16 August 2010
Tong Hsing to continue to ramp up LED thin film ceramic substrates
Ceramic substrate maker Tong Hsing Electronic Industries (THEIL) will continue to ramp up its capacity for LED thin film ceramic substrates through the end of the year on strong demand,...
Tuesday 10 August 2010
Chip-resistor substrate supply to remain tight through year-end 2010
Supply of chip-resistor substrates, especially for large-size resistor parts and high-power ones, will likely remain tight through the end of 2010, according to sources at Taiwan-based...
Wednesday 4 August 2010
Holy Stone posts profit decline in 2Q10 despite rise in revenues
Passive component maker Holy Stone Enterprise saw its pre-tax profits decline 17.4% sequentially to NT$249 million (US$7.84 million) in second-quarter 2010 although revenues were...
Wednesday 28 July 2010
Kinsus looks to strong demand for FC CSP and base station substrates in 3Q10
IC substrate maker Kinsus Interconnect Technology expects its revenues to grow 5-10% sequentially in the third quarter with flip-chip chip-scale packaging (FC CSP) and base station...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research