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Tuesday 22 December 2009
PCB makers to enjoy strong sales growth of LED heat sink substrates in 2010
Taiwan-based PCB makers, including Chin-Poon Industrial, Iteq, Taiflex Scientific, and Gia Tzoong Enterprise, are expected to enjoy sales contributions from aluminum heat sink substrates...
Wednesday 16 December 2009
Acme to double sapphire substrate capacity in 2010 on increasing LED demand
Taiwan-based inductor maker Acme Electronics plans to double capacity of its sapphire crystal substrates in 2010 to satisfy increasing LED demand. The company is seeing its sapphire...
Friday 4 December 2009
NPC sees on-month drop in November 2009 revenues
Nan Ya Printed Circuit Board (NPC) has announced revenues of NT$2.65 billion (US$82.36 million) for November 2009, down slightly by 1.37% on month. The company expects its December...
Wednesday 2 December 2009
Chipbond eyes outsourcing COF substrate orders from Mitsui subsidiary
Chipbond Technology has disclosed it is negotiating an outsourcing deal with MCS, a subsidiary of Japan-based Mitsui Kinzoku. Both parties have been evaluating the possibility of...
Wednesday 18 November 2009
Chip resistor substrate ASP will remain stable
Chip resistor substrate ASPs will not see large fluctuations as demand remains high, according to market sources. Alumina substrate supplier Leatec Fine Ceramics has resumed all of...
Friday 6 November 2009
Alumina substrate supplier Leatec expects 4Q09 revenues to grow
Leatec Fine Ceramics, a Taiwan-based alumina substrate supplier for chip resistor manufacturers, expects its fourth-quarter 2009 revenues to grow from NT$190 million (US$5.84 million)...
Tuesday 3 November 2009
NPC likely to receive FC substrate backend orders from Intel after NGK stops its supply
IC substrate supplier Nan Ya Printed Circuit Board (NPC) may see weaker order volumes in the short term because its Japan-based strategic partner NGK Spark Plugs has announced that...
Monday 26 October 2009
NPC expects strong revenues from FC CSP substrates in 2010
Nan Ya Printed Circuit Board (NPC) may see its revenues from flip-chip chip scale packaging (FC CSP) substrates double in 2010 because of significant demand from the handset segment,...
Wednesday 14 October 2009
Chip resistor substrate supplier Leatec maintaining high utilization rate in 4Q09
Leatec Fine Ceramics, a Taiwan-based alumina substrate supplier for chip resistor manufacturers, has seen clearer order visibility through the fourth quarter as customers are preparing...
Monday 28 September 2009
Chip resistor makers to see strong sales in September
Taiwan-based chip resistor makers Ta-I Technology and Ralec Electronic are both expected to see record sales in September due to strong demand, while Yageo's revenues will also remain...
Thursday 24 September 2009
LG Chem glass substrate investment not a major threat, says Corning CEO
Corning CEO and chairman Wendell P Weeks has commented that the entrance of LG Chem into the glass substrate segment may not pose a major threat as the industry has very high barriers...
Wednesday 23 September 2009
China-based Irico to raise fund for LCD glass substrate production
China-based panel maker Irico Group Electronics plans to issue new shares to raise up to 3.5 billion yuan (US$512.75 million) through private placement, according to a company announcement...
Friday 18 September 2009
CPT panel shipments improving as glass substrate shortage easing, says CFO
Chunghwa Picture Tubes (CPT) has seen shipments of both large-size and small- to medium- size panels increase as the supply of glass substrates is stabilizing, according to company...
Wednesday 16 September 2009
Niching Industrial says its memory card substrate supply falling short
The supply of NAND flash memory card substrates has recently fallen short of demand but is expected to ease in October, according to Taiwan-based semiconductor material supplier Niching...
Tuesday 18 August 2009
Kinsus FC CSP substrate utilization rate up on orders from Qualcomm
Taiwan-based IC substrate maker Kinsus Interconnect Technology has seen its capacity utilization for flip-chip chip scale packaging (FC CSP) substrates rise to more than 80% and the...