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ASE gears up for 2.5D, 3D IC commercialization

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Thursday 9 September 2010 0

3D IC Technology holds great promise for manufacturing at 20nm and beyond, bridging the gap between SoC and future system requirements. Because of its high technical thresholds, integrated 3D IC solutions will not be commercialized on a large scale...

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