Taiwan makers poised to scale up AiP substrate shipments in 2021

Jay Liu, Taipei; Willis Ke, DIGITIMES Asia Thursday 27 August 2020 0

Taiwan-based IC substrate makers Unimicron, Nan Ya PCB and Kinsus Interconnect are expected to significantly scale up their AiP (antenna-in-package) substrate shipments in 2021, driven by demand for mmWave AiP modules rolled out by Qualcomm for 5G iPhones...

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