ASE, SPIL to expand high-end process capacity

Ingrid Lee, Taipei; Meiling Chen, DIGITIMES Asia Monday 3 August 2009 0

Advanced Semiconductor Engineering (ASE) plans to increase wire-bond and bumping capacity, and Siliconware Precision Industries (SPIL) will expand its flip-chip (FC) ball-grid array (BGA) packaging lines, to satisfy strong demand from emerging markets,...

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