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BIWIN Mini SSD: Innovative storage expansion solution for edge AI era

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Credit: Biwin

As edge AI applications experience rapid proliferation, intelligent terminal devices, such as ultra-thin laptops, tablets, and AI edge computing terminals, are facing exponentially growing demands for storage performance and capacity. However, conventional storage solutions are increasingly revealing their inherent shortcomings:

Traditional SSD expansion requires case disassembling, a cumbersome process necessitating specialized tools and technical expertise, which elevates after-sales service costs.

While memory card solutions offer portability, CF cards are constrained by performance limitations, struggling to meet the high-speed read/write requirements of AI applications. High-end alternatives like CFexpress deliver comparable speeds but are hindered by limited interface compatibility and cost-effectiveness.

Embedded storage options (such as eMMC and UFS) lack post-purchase expandability, making it difficult for terminal manufacturers to flexibly respond to users' growing storage needs.

Addressing these challenges, BIWIN introduces the Mini SSD—a compact, modular, high-performance storage solution designed to empower terminal manufacturers to overcome the constraints of traditional storage systems and capitalize on emerging opportunities in the edge AI storage market.

Credit: Biwin

The BIWIN Mini SSD is featured with advanced LGA packaging processes, minimizing its dimensions to as compact as 15 × 17 × 1.4mm. Credit: Biwin

01 Innovative Design for Seamless Storage Expansion

The BIWIN Mini SSD is featured with advanced LGA packaging processes, minimizing its dimensions to as compact as 15 × 17 × 1.4mm, approximately only 15% of the area of a conventional M.2 2280 SSD, with a significantly thinner profile akin to a mobile SIM card. This drastic size reduction optimizes internal device space, unlocking greater flexibility for layout design, thermal management, and battery capacity enhancements.

Building on this compact form factor, the Mini SSD introduces a pioneering "standardized slot-based plug-and-play" architecture to the SSD domain. Users can upgrade to terabyte-scale storage with a straightforward three-step process: open the bay, insert the card, and lock it in place. This tool-free physical upgrade approach revolutionizes the storage expansion experience, alleviating manufacturers from complex after-sales maintenance and inventory challenges while enabling true "storage capacity customization."

Credit: Biwin

Building on this compact form factor, the Mini SSD introduces a pioneering "standardized slot-based plug-and-play" architecture to the SSD dom. Credit: Biwin

02 Flagship Performance, High-Speed Data Transfer Empowering AI Applications

Despite its miniaturized design, the Mini SSD delivers uncompromising performance. Equipped with a PCIe 4.0 ×2 high-speed interface, it achieves sequential read and write speeds of up to 3700MB/s and 3400MB/s, respectively—far surpassing typical memory card solutions and rivaling mainstream consumer-grade M.2 SSDs. This capability ensures seamless performance in high-demand scenarios such as AI model loading, 4K/8K video editing, and large-scale design software operation, fully meeting the stringent storage requirements of edge AI terminals.

Credit: Biwin

Flagship Performance, High-Speed Data Transfer Empowering AI Application. Credit: Biwin

03 Technology-Driven Innovation for Competitive Differentiation

The Mini SSD's core strengths stem from BIWIN's industry-leading expertise in storage solution development, IC design, and advanced packaging and testing processes, underpinned by a robust end-to-end supply chain. For terminal manufacturers seeking to differentiate their offerings in the AI era and avoid homogenization in the red ocean market, the Mini SSD presents a compelling pathway:

Standardized interfaces and modular design help streamline BOM (Bill of Materials) management, reducing production and inventory costs.

User-upgradeable storage capabilities minimize after-sales service demands, enhancing product lifecycle efficiency.

Cutting-edge packaging and testing processes ensure stable high-frequency signal transmission and system reliability, elevating overall product quality and competitiveness.

Article edited by Jack Wu