Tescan will showcase its integrated semiconductor failure analysis solutions at SEMICON China 2026, covering key stages from non-destructive testing and defect exposure to sample preparation, analysis, and structural verification. The company aims to help customers improve defect localization efficiency and analytical accuracy in response to growing demand from advanced packaging and other applications.
As advanced packaging, MEMS, and highly integrated semiconductor devices continue to evolve, the industry is placing greater demands on the speed, precision, and cross-platform coordination of failure analysis workflows. At this year's exhibition, Tescan will present a complete workflow from defect discovery to root-cause verification, helping laboratories improve efficiency and accelerate problem-solving.
Defect Discovery
Tescan UniTOM HR 2 supports millimeter-scale non-destructive testing and delivers sub-micron, high-resolution 4D visualization and analysis. Its second-generation system combines Dynamic to Detail Imaging technology with the Panthera AI denoising algorithm to further enhance 4D image quality and defect detection efficiency during rapid scanning.
Defect Exposure
Tescan FemtoChisel helps accelerate workflows for critical-region exposure. Under specific application conditions, the femtosecond laser processing platform can increase sample preparation speed by up to 5x while enabling cleaner cross-sections with lower thermal impact. This helps reduce focused ion beam (FIB) rework and improve overall analytical efficiency and result reliability.
Sample Preparation and Analysis
Tescan's Ga+ focused ion beam system has been upgraded with the second-generation Orage 2 ion column, which, under specific application conditions, can improve automated transmission electron microscope (TEM) sample preparation efficiency by up to 40%. Tescan SOLARIS X 2 Plasma FIB-SEM also supports applications in advanced integrated circuit packaging, microelectromechanical systems (MEMS), and display device testing, including TEM sample preparation, cross-sectioning, delayering, and in situ nanoprobing.
Verification and Correlative Analysis
Tescan leverages STEM imaging, EDS elemental mapping, and 4D-STEM capabilities to help users better understand the relationship between material structure and function. Tescan TENSOR, a highly automated analytical STEM platform, is optimized for 4D-STEM measurement and integrates precession electron diffraction technology to support process development and failure analysis.
During the exhibition, Tescan will host a series of on-site technical talks from March 25 to 26 at E4-4590 in the Productronica China exhibition area. Visitors can also meet the Tescan team at booth T4-4446 during SEMICON China 2026 in Shanghai from March 25 to 27. Tescan welcomes semiconductor manufacturing and analysis professionals to connect with its technical team and discuss real-world analytical challenges and application needs.
