As the demand for high-performance power semiconductors continues to escalate across automotive and industrial sectors, Henkel is addressing one of the industry's most pressing challenges: thermal management in next-generation power devices.
Henkel will host a technical webinar introducing its patented Polymerization-Induced Phase Separation technology platform-an advanced solution engineered to meet the evolving requirements of power device performance, reliability, and cost-efficiency.
Thermal Control as a Critical Enabler
With rising operational temperatures directly impacting device reliability and efficiency, effective heat dissipation has become essential. The industry's transition to bare copper (Cu) designs-driven by cost and reliability considerations-further underscores the need for die attach materials that combine high thermal conductivity with Cu compatibility.
Henkel's innovative technology enables die attach formulations that could meet automotive Grade 0 thermal cycling and MSL1 reliability standards; provide high bulk thermal conductivity for metallized or bare silicon die; ensure compatibility with a wide range of die finish and lead frame combinations, including bare copper; deliver improved RDS(on) performance compared to conventional die attach materials; support copper wire bonding processes.
This event marks the first installment in Henkel's Power Device Webinar Series, designed to provide engineers, designers, and industry stakeholders with insights into materials innovations that address the increasing demands of power semiconductor applications.
To particiapting in this webinar titled :"What's Powering the Next-Gen Power Device Performance" on 2025/11/28 10:00-10:45 am (Singaporean Time GMT+8), please register, click here to register.
Participants will gain exclusive access to Henkel's technical experts and learn how this proprietary platform is setting new benchmarks in thermal performance and reliability for power devices.
