Intel CEO Lip-Bu Tan met with Malaysian Prime Minister Anwar Ibrahim on December 1, 2025, where Anwar announced an additional investment of MYR860 million (approx. US$208 million) to strengthen Malaysia's position in the semiconductor packaging and testing market.
Anwar expressed confidence in Malaysia's long-term policy planning, which underpins Intel's decision to increase its investment. Intel also thanked the Malaysian government for its support, noting that its advanced packaging facility in Penang is 99% complete, with a total investment of MYR12 billion.
Earlier reports in 2024 suggested delays at Intel's Penang advanced packaging plant, but both Intel and the Malaysian government reaffirmed their commitment to the project.
Intel has maintained a presence in Penang since 1972 and remains a key driver of Malaysia's electronics and electrical (E&E) industry development, currently employing over 10,000 people in the country.
Under Malaysia's National Semiconductor Strategy (NSS), cultivating high-level talent is a top priority. Anwar highlighted that over the past two years, Intel has invested MYR2.8 million in collaborating with various educational institutions across Malaysia to launch R&D initiatives.
Amid US tariff pressures, the Malaysian government hopes that increased local investments by American companies like Intel will demonstrate Malaysia's critical role in the US manufacturing supply chain to the Trump administration.
Article edited by Jack Wu
