SK Hynix builds HBM packaging hub in Cheongju to expand AI memory capacity

Levi Li

, DIGITIMES Asia, Taipei

Apr 23, 2026, 08:03 0

Credit: SK Hynix

SK Hynix has broken ground on a large-scale advanced packaging facility in Cheongju Technopolis, underscoring how the battleground for AI semiconductors is shifting beyond wafer fabrication to the back-end processes that increasingly define performan...

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