Intel makes first major move into India's semiconductor ecosystem with advanced glass substrate manufacturing MoU

, DIGITIMES Asia, Taipei

May 30, 2026, 07:53, Updated: May 30, 2026, 07:54 0

Credit: Ashwini Vaishnaw's X

India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's...

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