Recent industry reports reveal that Micron is preparing to begin mass production of its 12-layer HBM3E memory for Nvidia, potentially creating significant pressure on Samsung Electronics as it struggles to keep pace with this advancement, which could impact its memory business.
According to reports from Seoul Economic Daily and Business Korea, Micron is making significant progress with its 12-layer HBM3E technology. Following sample distribution to customers in 2024, Micron's CFO Mark Murphy highlighted at a Wolfe Research event that their 12-layer HBM3E products achieve 20% less power consumption while delivering 50% more capacity compared to competitors' 8-layer versions. Murphy projects that 12-layer products will dominate HBM production by late 2025.
Industry sources indicate that Micron is nearing completion of its sample testing, marking an important step toward mass production, particularly for key customer Nvidia. The company's advancement in 12-layer HBM3E production could pose significant challenges for Samsung, which has yet to secure Nvidia's validation for either its 8-layer or 12-layer products.
Samsung has initiated limited mass production of its 8-layer HBM3E but continues to trail SK Hynix and Micron, with production volumes remaining constrained. Its 12-layer version remains in development, with sample delivery to Nvidia targeted for the end of February 2025. However, obtaining final supply approval will require additional time.
During its most recent earnings call, Samsung announced that improved HBM3E products would be available to select customers by the end of the first quarter of 2025, with increased supply commencing in the second quarter. Industry analysts suggest that Samsung intends to launch enhanced versions of both 8-layer and 12-layer HBM3E, focusing on improving HBM architecture for better yield and performance through modifications to equipment and materials during manufacturing.
Looking ahead, Murphy revealed Micron's plans to ship HBM4 in 2026, intensifying competition in the HBM market. Samsung has set its sights on mass-producing HBM4 using advanced 1c DRAM technology by 2025 while continuing its efforts to improve DRAM performance and yield.
