Asia

REALTIME NEWS

Singapore's small nation strategy offers new insights for Taiwan's tech industry

Tomorrow's Headlines

PC chip makers expect seasonal demand to vanish in 2026 amid early stocking

Tomorrow's Headlines

Alibaba's Jack Ma highlights societal challenges under

Tomorrow's Headlines

Commentary: HBM hybrid bonding equipment faces intense competition; adoption will take time

Tomorrow's Headlines

US tech giants sign power pledge to address AI energy crunch

Tomorrow's Headlines

Home Tech Semiconductors

Samsung reportedly lands US$550 million state loan for chipmaking equipment

Lillian Chen, Taipei Jan 12, 2026, 10:04 0

Credit: AFP

Samsung Electronics has reportedly secured KRW800 billion (US$550 million) through a low-interest loan program from the Korea Development Bank, according to sources cited by Korean media.

The article requires paid subscription. Subscribe Now

LOGIN

Email address

Password

Save my User ID and Password

Save my User ID and Password

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

NEW individual users please REGISTER first.

Enterprise user first-time LOGIN.

I forgot my ID and/or password?

MEMBERSHIP BENEFITS

Full access to articles dating back to 2000.
Real-time access to the news as it breaks.
Access to premium content.
Full access to Tomorrow's Headlines.
Asia Supply Chain 250 dataset access.

biz

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

marketing

MOST-READ
7 DAYS NEWS