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AMD opens EFB front beyond CoWoS, putting Taiwan substrate trio in play

, Taipei

Jun 16, 2026, 14:36 0

AMD CEO Lisa Su. Credit: DIGITIMES

The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC...

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