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TSMC to integrate CoWoS and SiPh in 2026, sources say

Monica Chen, Hsinchu; Rodney Chan, DIGITIMES Asia Friday 13 December 2024 0

Credit: DIGITIMES

According to industry sources, TSMC is working to integrate CoWoS and SiPh, seeking to launch co-packaged optics (CPO) in 2026 that may inject fresh momentum into the semiconductor industry.

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